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参数资料
| 型号： | TDA1308T-T |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | 音频／视频放大 |
| 英文描述： | 0.04 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO8 |
| 封装： | 3.90 MM, PLASTIC, MS-012, SOT-96-1, SOP-8 |
| 文件页数： | 2/17页 |
| 文件大小： | 576K |
| 代理商： | TDA1308T-T |
TDA1308
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 5 — 14 March 2011
10 of 17
NXP Semiconductors
TDA1308
Class-AB stereo headphone driver
Fig 12. Package outline SOT505-1 (TSSOP8)
UNIT
A1
A
max.
A2
A3
bp
L
HE
Lp
wy
v
ce
D(1)
E(2)
Z(1)
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
0.15
0.05
0.95
0.80
0.45
0.25
0.28
0.15
3.1
2.9
3.1
2.9
0.65
5.1
4.7
0.70
0.35
6
°
0
°
0.1
0.94
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.7
0.4
SOT505-1
99-04-09
03-02-18
w M
bp
D
Z
e
0.25
14
8
5
θ
A
A2
A1
Lp
(A3)
detail X
L
HE
E
c
v M A
X
A
y
2.5
5 mm
0
scale
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm
SOT505-1
1.1
pin 1 index
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相关代理商/技术参数 |
参数描述 |
|---|---|
| TDA1308TT/N1,118 | 功能描述:音频放大器 STEREO HEADPHONE DRIVER-TSSOP RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| TDA1308TT/N2 | 制造商:NXP Semiconductors 功能描述:AMP AUDIO .08W STER AB 8TSSOP 制造商:NXP Semiconductors 功能描述:AMP, AUDIO, .08W, STER, AB, 8TSSOP |
| TDA1308TT/N2,118 | 功能描述:音频放大器 STEREO HDPHON DRVR RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| TDA1308TT/N2118 | 制造商:NXP Semiconductors 功能描述:IC AUDIO AMP AB 40mW TSSOP-8 |
| TDA1308TT/N2-T | 功能描述:音频放大器 STEREO HDPHON DRVR CLASS AB RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
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