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参数资料
| 型号： | TDA1517/N3 |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | 音频／视频放大 |
| 英文描述： | 6 W, 2 CHANNEL, AUDIO AMPLIFIER, PSFM9 |
| 封装： | PLASTIC, SOT-110-1, SILMPF-9 |
| 文件页数： | 4/15页 |
| 文件大小： | 318K |
| 代理商： | TDA1517/N3 |
2004 Feb 18
12
NXP Semiconductors
Product specification
2 x 6 W stereo power amplifier
TDA1517; TDA1517P
SOLDERING
Introduction to soldering through-hole mount
packages
This text gives a brief insight to wave, dip and manual
soldering. A more in-depth account of soldering ICs can be
found in our “Data Handbook IC26; Integrated Circuit
Packages” (document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of
through-hole mount IC packages on a printed-circuit
board.
Soldering by dipping or by solder wave
Driven by legislation and environmental forces the
worldwide use of lead-free solder pastes is increasing.
Typical dwell time of the leads in the wave ranges from
3 to 4 seconds at 250
°C or 265 °C, depending on solder
material applied, SnPb or Pb-free respectively.
The total contact time of successive solder waves must not
exceed 5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg(max)). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300
°C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400
°C, contact may be up to 5 seconds.
Suitability of through-hole mount IC packages for dipping and wave soldering methods
Notes
1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
2. For PMFP packages hot bar soldering or manual soldering is suitable.
PACKAGE
SOLDERING METHOD
DIPPING
WAVE
CPGA, HCPGA
suitable
DBS, DIP, HDIP, RDBS, SDIP, SIL
suitable
suitable(1)
not suitable
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相关代理商/技术参数 |
参数描述 |
|---|---|
| TDA1517P | 制造商:NXP Semiconductors 功能描述: |
| TDA1517P/N3 | 制造商:NXP Semiconductors 功能描述:AMP AUDIO PWR 6W STER 18HDIP 制造商:NXP Semiconductors 功能描述:AMP, AUDIO, PWR, 6W, STER, 18HDIP |
| TDA1517P/N3,112 | 功能描述:音频放大器 2X6W STEREO PWR AMP RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| TDA1517P/N3112 | 制造商:NXP Semiconductors 功能描述:IC AUDIO AMP B 6W DIP-18 |
| TDA1518 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:24 W BTL or 2 x 12 watt stereo car radio power amplifier |
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