参数资料
| 型号： | TDA21302 |
| 厂商： | Infineon Technologies |
| 文件页数： | 22/25页 |
| 文件大小： | 0K |
| 描述： | IC CTRLR PWM MULTI CPU PDSO-32 |
| 产品变化通告： | Product Discontinuation 30/Jul/2007 |
| 标准包装： | 1,000 |
| 应用： | PWM控制器，CPU 内核 |
| 输入电压： | 4.5 V ~ 5.5 V |
| 输出数： | 4 |
| 输出电压： | 0.8375 V ~ 1.6 V |
| 工作温度： | 0°C ~ 70°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 32-SOIC（0.295"，7.50mm 宽） |
| 供应商设备封装： | DSO-32 |
| 包装： | 带卷 (TR) |
| 其它名称： | SP000014900 TDA21302T |
3. MOSFET drivers :
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Both of the decoupling capacitors for VCC and PVCC should be placed as close to the driver IC
as possible.
The bootstrap capacitor should be placed close to the BOOT pin.
The traces of GATE HS and PHASE should be routed in parallel and to keep it short and wide.
The width of the trances should be no less than 40mils.
High current loops from the input capacitor, high side MOSFET, output inductors and output
capacitors back to the input capacitor negative terminal should be kept the distance minimized.
The conjunction of high side MOSFET, low side MOSFET and output inductor should be kept as
close as possible.
4. Other Path :
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The components from the compensation network, high frequency bypass capacitors and the
setting resistors should be placed near controller IC and away from the noisy power path.
The thermal compensation thermistor should be placed at the hottest point which is
normally the MOSFETs located at the inner part of the power stage.
CoreControl TM
Page 22 of 25
DS-CoreControl-TDA21302
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