参数资料
型号: TDA2270
厂商: STMICROELECTRONICS
元件分类: 偏转
英文描述: VERTICAL DEFLECTION IC, PDIP16
封装: POWER, PLASTIC, DIP-16
文件页数: 6/7页
文件大小: 592K
代理商: TDA2270
2
7
0
-0
9
.EPS
Figure 4 :
Example of P.C. Board Copper Area
which is Used as Heatsink
2
7
0
-1
0
.EPS
Figure 5 :
External Heatsink Mounting Example
MOUNTING INSTRUCTIONS
The Rth j-amb of the TDA 2270 can be reduced by
soldering the GND pins to a suitable copper area
of the printed circuit board (fig. 4) or to an external
heatsink (fig. 5).
The diagram of figure 6 shows the maximum dissi-
pable power Ptot and the Rth j-amb as a function of
the side "l" of two equal square copper areas having
a thickness of 35
(1.4 mils).
During soldering the pins temperature must not
exceed 260 °C and the soldering time must not be
longer than 12 seconds.
The external heatsink or printed circuit copper area
must be connected to electrical ground.
2
7
0
-1
1
.EPS
Figure 6 :
Maximum Dissipable Power and Junc-
tion to Ambient Thermal Resistance
versus Side "l"
2
7
0
-1
2
.EPS
Figure 7 :
Maximum Allowable Power Dissipa-
tion versus Ambient Temperature
TDA2270
6/7
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