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参数资料
| 型号： | TDA3608TH/N3C,518 |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | 模拟信号调理 |
| 英文描述： | SPECIALTY ANALOG CIRCUIT, PDSO20 |
| 封装： | PLASTIC, HSOP-20 |
| 文件页数： | 13/22页 |
| 文件大小： | 122K |
| 代理商： | TDA3608TH/N3C,518 |
2003 Nov 28
20
Philips Semiconductors
Product specication
Multiple voltage regulators with switch
TDA3608Q; TDA3608TH
Suitability of IC packages for wave, reow and dipping soldering methods
Notes
1. For more detailed information on the BGA packages refer to the
“(LF)BGA Application Note” (AN01026); order a copy
from your Philips Semiconductors sales office.
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
3. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
4. Hot bar soldering or manual soldering is suitable for PMFP packages.
5. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account
be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature
exceeding 217
°C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature
must be kept as low as possible.
6. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
7. If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
8. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
9. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
10. Hot bar or manual soldering is suitable for PMFP packages.
11. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted
on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar
soldering process. The appropriate soldering profile can be provided on request.
MOUNTING
PACKAGE(1)
SOLDERING METHOD
WAVE
REFLOW(2) DIPPING
Through-hole mount CPGA, HCPGA
suitable
suitable
DBS, DIP, HDIP, RDBS, SDIP, SIL
suitable(3)
Through-hole-
surface mount
PMFP(4)
not suitable
Surface mount
BGA, HTSSON..T(5), LBGA, LFBGA, SQFP,
SSOP-T(5), TFBGA, USON, VFBGA
not suitable
suitable
DHVQFN, HBCC, HBGA, HLQFP, HSO,
HSOP, HSQFP, HSSON, HTQFP, HTSSOP,
HVQFN, HVSON, SMS
not suitable(6)
suitable
PLCC(7), SO, SOJ
suitable
LQFP, QFP, TQFP
not recommended(7)(8) suitable
SSOP, TSSOP, VSO, VSSOP
not recommended(9)
suitable
CWQCCN..L(11), PMFP(10), WQCCN32L(11)
not suitable
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相关代理商/技术参数 |
参数描述 |
|---|---|
| TDA3608THQ | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Multiple voltage regulators with switch |
| TDA3609 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Multiple voltage regulator with switch and ignition buffers |
| TDA3609JR | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Multiple voltage regulator with switch and ignition buffers |
| TDA3615J | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Multiple voltage regulator |
| TDA3615J/N2,112 | 功能描述:线性稳压器 - 标准 CARRADIO POWER AMPLIFIERS RoHS:否 制造商:STMicroelectronics 输出类型: 极性: 输出电压:1.8 V 输出电流:150 mA 负载调节: 最大输入电压:5.5 V 线路调整率: 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:SOT-323-5L |
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