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参数资料
| 型号： | TDA7266P |
| 厂商： | STMICROELECTRONICS |
| 元件分类： | 音频／视频放大 |
| 英文描述： | 3 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO24 |
| 封装： | POWER, SSO-24 |
| 文件页数： | 11/12页 |
| 文件大小： | 129K |
| 代理商： | TDA7266P |
TDA7266P
8/12
4
PCB LAYOUT AND EXTERNAL COMPONENTS
Regarding the PCB layout care must be taken for three main subjects:
1) Signal and Power Gnd separation
2) Dissipating Copper Area
3) Filter Capacitors positioning
1) Signal and Power Gnd separation:
To the Signal GND must be referred the Audio Input Signals, the Mute and Stand-by Voltages and the
device PIN.14. This Gnd path must be as clean as possible in order to improve the device THD+Noise
and to avoid spurious oscillations across the speakers.
The Power GND is directly connected to the Output power Stage transistors (Emitters) and is crossed
by large amount of current, this path is also used in this device to dissipate the heating generated (no
needs of external heatsinker).
Referring to the typical application circuit, the separation between the two GND paths must be obtained
connecting them separately (star routing) to the bulk
Electrolithic capacitor C1 (470
F).
Regarding the Power Gnd dimensioning we have to consider the Dissipated Power the Thermal Pro-
tection Threshold and the Package thermal Characteristics.
2) Dissipating Copper Area:
Dissipated Power:
The max dissipated power happens for a THD near 1% and is given by the formula:
This gives for: Vcc = 7.5V, Rl = 8
,Iq = 40mA a dissipated power of Pd = 3W.
Thermal Protection:
The thermal protection threshold is placed at a junction temperature of 150°C.
Package Thermal Characteristics:
The thermal resistance Junction to Ambient obtainable with a GND copper Area of 3x3 cm and with 16 via
holes (see picture) is about 25°C/W. This means that with the above mentioned max dissipated Power
(Pd=3W) we can expect a 75°C, this gives a safety margin before the thermal protection intervention in the
consumer environments where a 50°C ambient is specified as maximum
Figure 11.
3)Filter Capacitors Positioning:
The two Ceramic capacitors C2/C7 (100nF) must be placed as close as possible
respectively to the two Vcc pins ( 7 - 18) in order to avoid the possibiltiy of oscillations arising on the
output Audio signals.
P
dm ax W
()
2
V
CC
2
π
2
Rl
2
------
--------------
I
q VCC
+
=
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相关代理商/技术参数 |
参数描述 |
|---|---|
| TDA7266P13TR | 功能描述:音频放大器 Dual Bridge AMP 3W 3.5V to 12V RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| TDA7266S | 功能描述:音频放大器 5W Dual Bridge Amp RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| TDA7266SA | 功能描述:音频放大器 7W, 7W Dual Bridge 3.5 - 18V AMP RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| TDA7266SA-LG | 制造商:ST 功能描述:7W+7W DUAL BRIDGE AMPLIFIER |
| TDA7266SAN | 制造商:STMicroelectronics 功能描述:SADA_5 W + 5 W dual bridge amplifier |
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