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参数资料
| 型号： | TDA7269SA |
| 厂商： | STMICROELECTRONICS |
| 元件分类： | 音频／视频放大 |
| 英文描述： | 10 W, 2 CHANNEL, AUDIO AMPLIFIER, PZFM11 |
| 封装： | CLIPWATT-11 |
| 文件页数： | 9/11页 |
| 文件大小： | 214K |
| 代理商： | TDA7269SA |
Obsolete
Product(s)
- Obsolete
Product(s)
7/11
TDA7269SA
5
HEAT SINK DIMENSIONING:
In order to avoid the thermal protection intervention, that is placed approximatively at Tj = 150°C, it is im-
portant the dimensioning of the Heat Sinker RTh (°C/W).
The parameters that influence the dimensioning are:
– Maximum dissipated power for the device (Pdmax)
– Max thermal resistance Junction to case (RTh j-c)
– Max. ambient temperature Tamb max
– Quiescent current Iq (mA)
5.1 Example:
VCC = ±14V, Rload = 8ohm, RTh j-c = 3.9 °C/W , Tamb max = 50°C
Pdmax = (N° channels)
Pdmax = 2 ( 4.96 ) + 0.84 = 10.7 W
(Heat Sinker)
In figure 7 is shown the Power derating curve for the device.
Figure 10. Power derating curve
2V
cc
2
Π
2
R
lo ad
--------------------------
I
q
V
cc
+
R
Th c-a
150
T
am b max
–
P
d max
-----------------------------------------
R
Th j-c
–
150
50
–
10.7
----------------------
3.9
–
5.4
°C/W
==
=
a)
Infinite Heatsink
b)
5.0 °C/ W
c)
7.0 °C/ W
(c)
(a)
(b)
0
5
10
15
20
25
0
40
80
120
160
Tamb (°C)
Pd
(
W
)
a)
Infinite Heatsink
b)
5.0 °C/ W
c)
7.0 °C/ W
(c)
(a)
(b)
0
5
10
15
20
25
0
40
80
120
160
Tamb (°C)
Pd
(
W
)
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