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参数资料
| 型号： | TDA8763AM/4/C4 |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | ADC |
| 英文描述： | 1-CH 10-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PDSO28 |
| 封装： | PLASTIC, SOT-341-1, SSOP-28 |
| 文件页数： | 13/29页 |
| 文件大小： | 241K |
| 代理商： | TDA8763AM/4/C4 |
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1999 Jan 06
20
Philips Semiconductors
Product specication
10-bit high-speed low-power ADC
TDA8763A
Suitability of surface mount IC packages for wave and reow soldering methods
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW(1)
BGA, SQFP
not suitable
suitable
HLQFP, HSQFP, HSOP, HTSSOP, SMS not suitable(2)
suitable
PLCC(3), SO, SOJ
suitable
LQFP, QFP, TQFP
not recommended(3)(4)
suitable
SSOP, TSSOP, VSO
not recommended(5)
suitable
Data sheet status
Objective specication
This data sheet contains target or goal specications for product development.
Preliminary specication
This data sheet contains preliminary data; supplementary data may be published later.
Product specication
This data sheet contains nal product specications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specication
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specication.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| TDA8763AM4DB-T | 功能描述:视频模拟/数字化转换器集成电路 10 BIT A/D LOW POWER RoHS:否 制造商:Texas Instruments 输入信号类型:Differential 转换器数量:1 ADC 输入端数量:4 转换速率:3 Gbps 分辨率:8 bit 结构: 输入电压:3.3 V 接口类型:SPI 信噪比: 电压参考: 电源电压-最大:3.45 V 电源电压-最小:3.15 V 最大功率耗散: 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:TCSP-48 封装:Reel |
| TDA8763AM5DB | 功能描述:视频模拟/数字化转换器集成电路 10 BITS ADC LO PWR 50MHZ RoHS:否 制造商:Texas Instruments 输入信号类型:Differential 转换器数量:1 ADC 输入端数量:4 转换速率:3 Gbps 分辨率:8 bit 结构: 输入电压:3.3 V 接口类型:SPI 信噪比: 电压参考: 电源电压-最大:3.45 V 电源电压-最小:3.15 V 最大功率耗散: 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:TCSP-48 封装:Reel |
| TDA8763AM5DB-T | 功能描述:视频模拟/数字化转换器集成电路 10 BITS ADC LO PWR 50MHZ RoHS:否 制造商:Texas Instruments 输入信号类型:Differential 转换器数量:1 ADC 输入端数量:4 转换速率:3 Gbps 分辨率:8 bit 结构: 输入电压:3.3 V 接口类型:SPI 信噪比: 电压参考: 电源电压-最大:3.45 V 电源电压-最小:3.15 V 最大功率耗散: 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:TCSP-48 封装:Reel |
| TDA8763M | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:10-bit high-speed low-power ADC with internal reference regulator |
| TDA8763M/2 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:Analog-to-Digital Converter， 10-Bit |
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