参数资料
型号: TDA8926TH
厂商: NXP SEMICONDUCTORS
元件分类: 音频/视频放大
英文描述: 50 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO24
封装: PLASTIC, SOT-566-3, HSOP-24
文件页数: 28/28页
文件大小: 233K
代理商: TDA8926TH
2002 Oct 22
9
Philips Semiconductors
Preliminary specication
Power stage 2
× 50 W class-D audio
amplier
TDA8926TH
9
LIMITING VALUES
In accordance with the Absolute Maximum Rate System (IEC 60134).
Notes
1. Human Body Model (HBM); Rs = 1500 ; C = 100 pF.
2. Machine Model (MM); Rs =10 ; C = 200 pF; L = 0.75 H.
10 THERMAL CHARACTERISTICS
11 QUALITY SPECIFICATION
In accordance with
“SNW-FQ611-part D” if this device is used as an audio amplifier (except for ESD, see also Chapter 9).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VP
supply voltage
±30
V
VP(sc)
supply voltage for
short-circuits across the load
±30
V
IORM
repetitive peak current in
output pins
5A
Tstg
storage temperature
55
+150
°C
Tamb
ambient temperature
40
+85
°C
Tvj
virtual junction temperature
150
°C
Ves(HBM)
electrostatic discharge
voltage (HBM)
note 1
all pins with respect to VDD (class 1a) 1000
+1000
V
all pins with respect to VSS (class 1a) 1000
+1000
V
all pins with respect to each other
(class 1a)
500
+500
V
Ves(MM)
electrostatic discharge
voltage (MM)
note 2
all pins with respect to VDD (class A1) 150
+150
V
all pins with respect to VSS (class B) 200
+200
V
all pins with respect to each other
(class A1)
100
+100
V
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
Rth(j-a)
thermal resistance from junction to ambient
in free air
40
K/W
Rth(j-c)
thermal resistance from junction to case
in free air
1
K/W
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