- 您现在的位置：买卖IC网 > PDF目录98204 > TDA8942P/N1,112 (NXP SEMICONDUCTORS) 1.5 W, 2 CHANNEL, AUDIO AMPLIFIER, PDIP16 PDF资料下载
参数资料
| 型号： | TDA8942P/N1,112 |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | 音频／视频放大 |
| 英文描述： | 1.5 W, 2 CHANNEL, AUDIO AMPLIFIER, PDIP16 |
| 封装： | 0.300 INCH, PLASTIC, SOT-38-1, MO-001, DIP-16 |
| 文件页数： | 11/22页 |
| 文件大小： | 394K |
| 代理商： | TDA8942P/N1,112 |
Philips Semiconductors
TDA8942P
2 x 1.5 W (3 W music power) stereo BTL audio amplier
Product data
Rev. 03 — 02 September 2003
19 of 22
9397 750 11707
Koninklijke Philips Electronics N.V. 2003. All rights reserved.
17. Soldering
17.1 Introduction to soldering through-hole mount packages
This text gives a brief insight to wave, dip and manual soldering. A more in-depth
account of soldering ICs can be found in our
Data Handbook IC26; Integrated Circuit
Packages (document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of through-hole mount IC
packages on a printed-circuit board.
17.2 Soldering by dipping or by solder wave
Driven by legislation and environmental forces the worldwide use of lead-free solder
pastes is increasing. Typical dwell time of the leads in the wave ranges from
3 to 4 seconds at 250
°C or 265 °C, depending on solder material applied, SnPb or
Pb-free respectively.
The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the
plastic body must not exceed the specied maximum storage temperature (Tstg(max)).
If the printed-circuit board has been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within the permissible limit.
17.3 Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron
bit is less than 300
°C it may remain in contact for up to 10 seconds. If the bit
temperature is between 300 and 400
°C, contact may be up to 5 seconds.
17.4 Package related soldering information
[1]
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the
printed-circuit board.
[2]
For PMFP packages hot bar soldering or manual soldering is suitable.
Table 10:
Suitability of through-hole mount IC packages for dipping and wave
soldering methods
Package
Soldering method
Dipping
Wave
DBS, DIP, HDIP, SDIP, SIL
suitable
suitable[1]
PMFP[2]
not suitable
相关PDF资料 |
PDF描述 |
|---|---|
| TDA8944AJ | 7 W, 2 CHANNEL, AUDIO AMPLIFIER, PZIP17 |
| TDA8946AJ | 15 W, 2 CHANNEL, AUDIO AMPLIFIER, PZIP17 |
| TDA9103 | HORIZ/VERT DEFLECTION IC, PDIP42 |
| TDA9105 | HORIZ/VERT DEFLECTION IC, PDIP42 |
| TDA9109/SN | HORIZ/VERT DEFLECTION IC, PDIP32 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| TDA8943 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:6 W mono Bridge Tied Load BTL audio amplifier |
| TDA8943SF | 制造商:PHILPS 功能描述: |
| TDA8943SF/N1,112 | 功能描述:音频放大器 6W MONO BTL PWR AMP RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| TDA8943SF/N1.112 | 制造商:NXP Semiconductors 功能描述:AMP AUDIO POWER SINGLE 8943 SIL-9 |
| TDA8944 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:2 x 7 W stereo Bridge Tied Load BTL audio amplifier |
发布紧急采购，3分钟左右您将得到回复。