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参数资料
| 型号： | TDA9874APS/V2 |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | 接收器 |
| 英文描述： | AM/FM, AUDIO DEMODULATOR, PDIP42 |
| 封装： | 0.600 INCH, PLASTIC, SDIP-42 |
| 文件页数： | 61/71页 |
| 文件大小： | 304K |
| 代理商： | TDA9874APS/V2 |
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2000 Aug 04
64
Philips Semiconductors
Product specication
Digital TV sound demodulator/decoder
TDA9874A
14.4
Suitability of IC packages for wave, reow and dipping soldering methods
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
4. If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
MOUNTING
PACKAGE
SOLDERING METHOD
WAVE
REFLOW(1)
DIPPING
Through-hole mount DBS, DIP, HDIP, SDIP, SIL
suitable(2)
suitable
Surface mount
BGA, SQFP
not suitable
suitable
HLQFP, HSQFP, HSOP, HTSSOP, SMS
not suitable(3)
suitable
PLCC(4), SO, SOJ
suitable
LQFP, QFP, TQFP
not recommended(4)(5)
suitable
SSOP, TSSOP, VSO
not recommended(6)
suitable
相关PDF资料 |
PDF描述 |
|---|---|
| TDA9874AH/V2 | AM/FM, AUDIO DEMODULATOR, PQFP44 |
| TDA3653CQ/N2 | VERTICAL DEFLECTION IC, PZIP9 |
| TDA3653C/N2 | VERTICAL DEFLECTION IC, PSIP9 |
| TDA3653B/N2 | VERTICAL DEFLECTION IC, PSFM9 |
| TDA3653CU | VERTICAL DEFLECTION IC, PSIP9 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| TDA9874H | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Digital TV sound demodulator/decoder |
| TDA9875 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Digital TV Sound Processor DTVSP |
| TDA9875A | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Digital TV Sound Processor DTVSP |
| TDA9875AH | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Digital TV Sound Processor DTVSP |
| TDA9875AH/V2,557 | 功能描述:IC SOUND PROC DGTL TV 64QFP RoHS:是 类别:集成电路 (IC) >> 线性 - 音频处理 系列:- 其它有关文件:STA321 View All Specifications 标准包装:1 系列:Sound Terminal™ 类型:音频处理器 应用:数字音频 安装类型:表面贴装 封装/外壳:64-LQFP 裸露焊盘 供应商设备封装:64-LQFP EP（10x10） 包装:Digi-Reel® 其它名称:497-11050-6 |
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