- 您现在的位置：买卖IC网 > PDF目录98209 > TDF8553J (NXP SEMICONDUCTORS) 87 W, 4 CHANNEL, AUDIO AMPLIFIER, PZFM37 PDF资料下载
参数资料
| 型号： | TDF8553J |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | 音频／视频放大 |
| 英文描述： | 87 W, 4 CHANNEL, AUDIO AMPLIFIER, PZFM37 |
| 封装： | PLASTIC, SOT725-1 |
| 文件页数： | 39/47页 |
| 文件大小： | 391K |
| 代理商： | TDF8553J |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页当前第39页第40页第41页第42页第43页第44页第45页第46页第47页
TDF8553J_1
NXP B.V. 2008. All rights reserved.
Objective data sheet
Rev. 01 — 3 December 2008
44 of 47
NXP Semiconductors
TDF8553J
4
× 50 Watt power amplier and multiple voltage regulator
14. Soldering of through-hole mount packages
14.1 Introduction to soldering through-hole mount packages
This text gives a very brief insight into wave, dip and manual soldering.
Wave soldering is the preferred method for mounting of through-hole mount IC packages
on a printed-circuit board.
14.2 Soldering by dipping or by solder wave
Driven by legislation and environmental forces the worldwide use of lead-free solder
pastes is increasing. Typical dwell time of the leads in the wave ranges from
3 seconds to 4 seconds at 250
°C or 265 °C, depending on solder material applied, SnPb
or Pb-free respectively.
The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic
body must not exceed the specied maximum storage temperature (Tstg(max)). If the
printed-circuit board has been pre-heated, forced cooling may be necessary immediately
after soldering to keep the temperature within the permissible limit.
14.3 Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is
less than 300
°C it may remain in contact for up to 10 seconds. If the bit temperature is
between 300
°C and 400 °C, contact may be up to 5 seconds.
14.4 Package related soldering information
[1]
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit
board.
[2]
For PMFP packages hot bar soldering or manual soldering is suitable.
Table 18.
Suitability of through-hole mount IC packages for dipping and wave soldering
Package
Soldering method
Dipping
Wave
CPGA, HCPGA
-
suitable
DBS, DIP, HDIP, RDBS, SDIP, SIL
suitable
suitable[1]
PMFP[2]
-
not suitable
相关PDF资料 |
PDF描述 |
|---|---|
| TDF8554J/N2 | 44 W, 4 CHANNEL, AUDIO AMPLIFIER, PZFM37 |
| TDF8554J/N4 | 44 W, 4 CHANNEL, AUDIO AMPLIFIER, PZFM37 |
| TDF8555J/N1 | 44 W, 4 CHANNEL, AUDIO AMPLIFIER, PZFM37 |
| TDF8599TD | 70 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO36 |
| TDF8599TH | 70 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO36 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| TDF8590TH | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:2 X 80 W SE (4 OHM) or 1 X 160 W BTL (8 OHM) class-D amplifier |
| TDF8590TH/N1,118 | 功能描述:音频放大器 AMPLIFIER CLASS D RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| TDF8590TH/N1S,118 | 功能描述:音频放大器 4/8 OHM CLASS D AMP RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| TDF8590TH/N1-T | 功能描述:音频放大器 AMPLIFIER CLASS D RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| TDF8590TH/N1TJ | 制造商:NXP Semiconductors 功能描述:- Tape and Reel |
发布紧急采购，3分钟左右您将得到回复。