- 您现在的位置：买卖IC网 > PDF目录358440 > TFB2022AIMFP (TEXAS INSTRUMENTS INC) SPECIALTY MICROPROCESSOR CIRCUIT, MQFP240 PDF资料下载
参数资料
| 型号： | TFB2022AIMFP |
| 厂商： | TEXAS INSTRUMENTS INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | SPECIALTY MICROPROCESSOR CIRCUIT, MQFP240 |
| 封装： | METAL, QFP-240 |
| 文件页数： | 1/10页 |
| 文件大小： | 154K |
| 代理商： | TFB2022AIMFP |
SLLS183 AUGUST 1994
Copyright
1994, Texas Instruments Incorporated
1
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
POST OFFICE BOX 1443
HOUSTON, TEXAS 772511443
Industrial Temperature Version of the
TFB2022A With an Operating Range of
20
°
C to 85
°
C
Parallel-Protocol Support Is Fully
Compliant to Futurebus+ Standard
(IEEE Std 896.11991)
Interfaces Easily to a Variety of Popular
Microprocessors Such as SPARC
, 680x0,
88xxx, 80x86, and Alpha AXP
Can Be Used in Conjunction With the
TFB2002A Futurebus+ I/O Controller or
Standalone With a User-Defined Controller
64 Data Channels and 8 Parity Channels on
Board
Supports 32 or 36 Bits of Addressing
On-Board Address Decoding Determines
Whether Transaction Is to Host Memory,
Extended Unit Space, Message-Passing
Mailbox, or Other CSR Location
Parallel-Protocol-Related CSR Locations
Are Provided on Chip
Provides Support for Module Live Insertion
Handles Both Packet and Compelled
Transfers
Capable of Buffering up to 256 Bytes Per
Transaction
description
The TFB2022AI data path unit (DPU) is a member of the Texas Instruments Futurebus+ (FB+) chip set. This
chip set provides an integrated approach to the Futurebus+ interface that reduces new-product design time,
allows more functionality per circuit board, improves overall interface reliability, and reduces end-user down time
through built-in test capabilities. The Futurebus+ chip set is capable of supporting 32- or 64-bit data widths in
any combination on both the host-bus interface (HIF) and Futurebus+. The address width is programmable to
be 32 bits or 36 bits (with either data width).
The TFB2022AI may be used with a TFB2002B Futurebus+ I/O controller to provide a complete 64-bit Profile-B
interface. It allows great flexibility in the design of the system and in the host features that may be supported.
It may also be used with a user-defined controller to provide a variety of performance features. When used
together, the TFB2022AI and TFB2002B provide the Futurebus+ and host-bus protocol control for the first
64 bits of data and 36 bits of address. The TFB2022AI contains a bidirectional FIFO for high-speed transmission
of data in either compelled or packet mode, address control for 36 bits of address, and related CSR locations.
All Profile-A- and Profile-B-required CSRs are implemented either on this device or the TFB2002B.
The TFB2022AI is optimized for Profile-B modules. Several processors may reside on a single module with the
DPU as long as they do not require the DPU/IOC to understand cache-coherent operation. The module may
contain memory or I/O units in addition to processors. The TFB2022AI is best suited for I/O or memory modules.
The MS<1:0> signals provide a preaddress decode mechanism, enabling the user to implement simplified
decode logic in the logic interface. These signals indicate whether an access is being made to host memory,
extended units space, host CSR space, or to a message mailbox.
The TFB2022AI is offered in a 240-pin metal quad flat package (MFP). The TFB2022AI is characterized for
operation over the industrial temperature range of 20
°
C to 85
°
C.
NOTE: To maintain consistency with the notation used in the Futurebus+ standard (IEEE Std 896.11991), an active-low signal is denoted herein
by use of the trailing asterisk (*) on the signal name.
!
"#$
!(
!!$*
%!&
%
%%
!+
"!
"! '! !
!
)*&
$$ "!!&
%
"!+
%!
$%!
SPARC is a trademark of Sun Microsystems, Inc.
Alpha AXP is a trademark of Digital Equipment Corporation.
相关PDF资料 |
PDF描述 |
|---|---|
| TFC-135-31-L-D | 70 CONTACT(S), MALE, STRAIGHT BOARD STACKING CONNECTOR, SOLDER |
| TFC-135-32-F-D | 70 CONTACT(S), MALE, STRAIGHT BOARD STACKING CONNECTOR, SURFACE MOUNT |
| TFC-135-32-L-D | 70 CONTACT(S), MALE, STRAIGHT BOARD STACKING CONNECTOR, SURFACE MOUNT |
| TFC-140-01-F-D | 80 CONTACT(S), MALE, STRAIGHT BOARD STACKING CONNECTOR, SOLDER |
| TFC-140-01-L-D | 80 CONTACT(S), MALE, STRAIGHT BOARD STACKING CONNECTOR, SOLDER |
相关代理商/技术参数 |
参数描述 |
|---|---|
| TFB-2D | 制造商:SUMIDA 制造商全称:Sumida Corporation 功能描述:Filter Coils |
| TFB-2DG | 制造商:SUMIDA 制造商全称:Sumida Corporation 功能描述:Filter Coils |
| TFB-2LDG | 制造商:SUMIDA 制造商全称:Sumida Corporation 功能描述:Filter Coils |
| TFB-2LG | 制造商:SUMIDA 制造商全称:Sumida Corporation 功能描述:Filter Coils |
| TFB-3 | 制造商:SUMIDA 制造商全称:Sumida Corporation 功能描述:Filter Coils |
发布紧急采购，3分钟左右您将得到回复。