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参数资料
| 型号： | TFBS6712-TR3 |
| 厂商： | Vishay Intertechnology,Inc. |
| 英文描述： | Low Profile Fast Infrared Transceiver (FIR, 4 Mbit/s) for IrDA Applications with Low voltage Logic (1.8 V) |
| 中文描述： | 超薄快速红外线收发器（4兆飞行情报区/秒）与低电压逻辑（1.8伏的IrDA应用） |
| 文件页数： | 9/14页 |
| 文件大小： | 228K |
| 代理商： | TFBS6712-TR3 |
www.vishay.com
27
8
Document Number
8
4674
Rev. 1.2, 21-Feb-07
TFBS6712
Vishay Semiconductors
Recommended Solder Profiles
Solder Profile for Sn/Pb soldering
Lead (Pb)-Free, Recommended Solder Profile
The TFBS6712 is a lead (Pb)-free transceiver and
qualified for lead (Pb)-free processing. For lead
(Pb)-free solder paste like Sn(3.0-4.0)Ag(0.5-0.9)Cu,
there are two standard reflow profiles: Ramp-Soak-
Spike (RSS) and Ramp-To-Spike (RTS). The Ramp-
Soak-Spike profile was developed primarily for reflow
ovens heated by infrared radiation. With widespread
use of forced convection reflow ovens the Ramp-To-
Spike profile is used increasingly. Shown below in fig-
ure 6 is VISHAY's recommended profiles for use with
the TFBS6712 transceivers. For more details please
refer to Application note: SMD Assembly Instruction.
Wave Soldering
For TFDUxxxx and TFBSxxxx transceiver devices
wave soldering is not recommended.
Manual Soldering
Manual soldering is the standard method for lab use.
However, for a production process it cannot be rec-
ommended because the risk of damage is highly
dependent on the experience of the operator. Never-
theless, we added a chapter to the above mentioned
application note, describing manual soldering and
desoldering.
Storage
The storage and drying processes for all VISHAY
transceivers (TFDUxxxx and TFBSxxx) are equiva-
lent to MSL4.
The data for the drying procedure is given on labels
on the packing and also in the application note
"Taping, Labeling, Storage and Packing"
(http://www.vishay.com/docs/
8
2601/
8
2601.pdf).
Figure 5. Recommended Solder Profile for Sn/Pb soldering
0
20
40
60
80
100
120
140
160
180
200
220
240
260
0
50
100
150
200
250
300
350
Time/s
T
u
r
2...4 °C/s
2...4 °C/s
10 s max. at 230 °C
120 s...180 s
160 °C max.
240 °C max.
90 s max.
19431
Figure 6. Solder Profile, RSS Recommendation
0
20
40
60
80
100
120
140
160
180
200
220
240
260
280
0
50
100
150
200
250
300
350
Time/s
T
u
r
20 s
2 °C...4 °C/s
2 °C...4 °C/s
90 s...120 s
T
≥
217 °C for 50 s max
Tpeak = 260 °C max.
50 s max.
T
≥
255 °C for 20 s max
19261
相关PDF资料 |
PDF描述 |
|---|---|
| TFBS6712 | Fast IrDA with Smallest Footprint; Low Profile; |
| TFBS6712-TR1 | Low Profile Fast Infrared Transceiver (FIR, 4 Mbit/s) for IrDA Applications with Low voltage Logic (1.8 V) |
| TFC561D | TO-220S Thyristor With Built-in Reverse Diode(内置反向二极管的晶闸管（可控硅TO-220S封装）) |
| TFD312S series | TO-220F 3A Thyristor with built-in Avalanche diode(3A，内置雪崩二极管的晶闸管（可控硅TO-220F封装）) |
| TFD312S | CONNECTOR ACCESSORY |
相关代理商/技术参数 |
参数描述 |
|---|---|
| TFBS6712-TT3 | 功能描述:红外收发器 FIR 4Mbit/s 2.4-3.6V Op Voltage RoHS:否 制造商:Vishay Semiconductors 波长:900 nm 连续数据传输:115.2 Kbit/s 传输距离:1 m 辐射强度:60 mW/sr 半强度角度:44 deg 脉冲宽度:2 us 最大上升时间:100 ns 最大下降时间:100 ns LED 电源电压:- 0.5 V to 6 V 最大正向电流:80 mA 工作电压:2.4 V to 5.5 V 最大工作温度:+ 85 C 最小工作温度:- 25 C 尺寸:6 mm x 3.1 mm x 1.9 mm 封装 / 箱体: 封装:Reel |
| TFC | 功能描述:保险丝 TFC RoHS:否 制造商:Littelfuse 产品:Surface Mount Fuses 电流额定值:0.5 A 电压额定值:600 V 保险丝类型:Fast Acting 保险丝大小/组:Nano 尺寸:12.1 mm L x 4.5 mm W 安装风格: 端接类型:SMD/SMT 系列:485 |
| TFC-105-01-F-D | 制造商:Samtec Inc 功能描述:CONN SHRD HDR HDR 10 POS 1.27MM SLDR ST TH - Bulk |
| TFC-105-01-F-D-A | 制造商:Samtec Inc 功能描述:CONN SHRD HDR HDR 10 POS 1.27MM SLDR ST TH - Bulk |
| TFC-105-01-F-D-A-K | 制造商:Samtec Inc 功能描述:.050 X .050 TERMINAL STRIP - Bulk |
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