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参数资料
| 型号： | TFDU2201-TR3 |
| 厂商： | Vishay Intertechnology,Inc. |
| 英文描述： | Low Profile Transceiver Module PIN Photodiode and Infrared Emitter |
| 中文描述： | 超薄收发模块PIN光电二极管和红外发射器 |
| 文件页数： | 3/9页 |
| 文件大小： | 227K |
| 代理商： | TFDU2201-TR3 |
TFDU2201
Vishay Semiconductors
Document Number 82539
Rev. 1.1, 08-Dec-04
www.vishay.com
3
Optoelectronic Characteristics
Receiver
Tested for the following parameters (T = 25 °:C, unless otherwise stated)
Parameter
Spectral sensitivity
|
α
|
≤
± 15 °, V
r
= 2 V,
λ
= 875 nm
Bias voltage range, detector
Transmitter
Tested for the following parameters (T = 25 °:C, unless otherwise stated)
Parameter
Forward current operating
condition for low power IrDA
operation
Output radiant intensity
|
α
|
≤
± 15 °, I
F1
= 35 mA, 25 %
duty cycle
|
α
|
≤
± 15 °, I
F1
= 350 mA, 25 %
duty cycle
Forward voltage
I
f
= 50 mA
Peak emission wavelength
Recommended Solder Profile
Solder Profile for Sn/Pb soldering
Lead-Free, Recommended Solder Profile
The TFDU2201 is a lead-free transceiver and quali-
fied for lead-free processing. For lead-free solder
paste like Sn(
3.0-4.0
)Ag(
0.5-0.9
)Cu, there are two stan-
dard reflow profiles: Ramp-Soak-Spike (RSS) and
Ramp-To-Spike (RTS). The Ramp-Soak-Spike profile
was developed primarily for reflow ovens heated by
infrared radiation. With widespread use of forced con-
vection reflow ovens the Ramp-To-Spike profile is
used increasingly. Shown below in figure 2 is Vishay’s
recommended profile for use with the TFDU2201
transceivers. For more details please refer to Applica-
tion note: SMD Assembly Instruction.
Test Conditions
Symbol
S
λ
Min
1.0
Typ.
1.2
Max
1.8
Unit
nA/(mW/m
2
)
V
Rev
12
V
Reverse leakage current
Spectral bandwith
Max. operating irradiance
0.2
nA
nm
W/m
2
ns
λ
800
8000
950
|
α
|
≤
± 90 °C, V
CC
= 2 V
V
r
= 2 V,
λ
= 875 nm
V
r
= 2 V,
λ
= 875 nm
E
e, max
t
r
t
r
15000
Rise time @ load : R = 50
Fall time @ load : R = 50
40
40
ns
Test Conditions
Symbol
I
F1
Min
Typ.
30
Max
Unit
mA
I
e
= 4 to 28 mW/sr in |
α
|
≤
± 15 °
I
e
4
8
14
mW/sr
I
e
35
mW/sr
V
f
λ
p
1.2
1.45
V
880
900
nm
Spectral emission bandwith
Optical rise/fall time
45
38
nm
ns
2 MHz square wave signal (duty
cycle 1 : 1)
Figure 1. Recommended Solder Profile for Sn/Pb soldering
Time ( s )
14874
0
20
40
60
80
100
120
140
160
180
200
220
240
0
50
100
150
200
250
300
350
2
°
C - 4
°
C/s
10 smax.
@ 230
°
C
90 s max
120 s - 180 s
2
°
C - 4
°
C/s
T
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相关代理商/技术参数 |
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| TFDU4100 | 制造商:VISHAY 制造商全称:Vishay Siliconix 功能描述:2.7-5.5V Serial Infrared Transceiver Module Family |
| TFDU4100 - TT3 | 制造商:Vishay Semiconductors 功能描述:OPTOELECTRONIC TRANSCEIvER LEADED PROCES |
| TFDU4100 | 制造商:Vishay Intertechnologies 功能描述:IRDA TRANSCEIVER |
| TFDU4100_05 | 制造商:VISHAY 制造商全称:Vishay Siliconix 功能描述:Serial Infrared Transceiver SIR, 115.2 kbit/s, 2.7 V to 5.5 V Operation |
| TFDU4100-TR3 | 功能描述:红外收发器 SIR 115.2 kbits/s RoHS:否 制造商:Vishay Semiconductors 波长:900 nm 连续数据传输:115.2 Kbit/s 传输距离:1 m 辐射强度:60 mW/sr 半强度角度:44 deg 脉冲宽度:2 us 最大上升时间:100 ns 最大下降时间:100 ns LED 电源电压:- 0.5 V to 6 V 最大正向电流:80 mA 工作电压:2.4 V to 5.5 V 最大工作温度:+ 85 C 最小工作温度:- 25 C 尺寸:6 mm x 3.1 mm x 1.9 mm 封装 / 箱体: 封装:Reel |
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