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参数资料
| 型号： | TFP403PZP |
| 厂商： | TEXAS INSTRUMENTS INC |
| 元件分类： | 消费家电 |
| 英文描述： | SPECIALTY CONSUMER CIRCUIT, PQFP100 |
| 封装： | 14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, HTQFP-100 |
| 文件页数： | 7/20页 |
| 文件大小： | 496K |
| 代理商： | TFP403PZP |
TFP403
TI PanelBus DIGITAL RECEIVER
SLDS125A DECEMBER 2000 REVISED OCTOBER 2002
15
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
detailed description (continued)
PowerPAD 100-TQFP package
The TFP403 is packaged in TI’s thermally enhanced PowerPAD 100TQFP packaging. The PowerPAD package
is a 14 mm
× 14 mm × 1 mm TQFP outline with 0.5 mm lead-pitch. The PowerPAD package has a specially
designed die mount pad that offers improved thermal capability over typical TQFP packages of the same outline.
The TI 100-TQFP PowerPAD package offers a back-side solder plane that connects directly to the die mount
pad for enhanced thermal conduction. Soldering the back side of the TFP403 to the application board is not
required thermally, as the device power dissipation is well within the package capability when not soldered.
Soldering the back side of the device to the PCB ground plane is recommended for electrical considerations.
Since the die pad is electrically connected to the chip substrate and hence chip ground, connection of the
PowerPAD back side to a PCB ground plane will help to improve EMI, ground bounce, and power supply noise
performance.
Table 1 outlines the thermal properties of the TI 100-TQFP PowerPAD package. The 100-TQFP non-PowerPAD
package is included only for reference.
Table 1. TI 100-TQFP (14
× 14 × 1 mm)/0.5 mm Lead Pitch
PARAMETER
WITHOUT
PowerPAD
NOT CONNECTED TO PCB
THERMAL PLANE
PowerPAD
CONNECTED TO PCB
THERMAL PLANE
Theta-JA,
45
°C/W
27.3
°C/W
17.3
°C/W
Theta-JC,
3.11
°C/W
0.12
°C/W
0.12
°C/W
Maximum power dissipation,,§
1.6 W
2.7 W
4.3 W
Specified with 2 oz. Cu PCB plating.
Airflow is at 0 LFM (no airflow)
§ Measured at ambient temperature, TA = 70°C.
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| TFP403PZPG4 | 功能描述:显示接口集成电路 PanelBus DVI Rcvr RoHS:否 制造商:Texas Instruments 电源电流:125 mA 工作温度范围:- 40 C to + 105 C 封装 / 箱体:WQFN-60 封装:Reel |
| TFP41 | 制造商:HOFFMAN ENCLOSURES 功能描述:COOLING FAN PACKAGE, 4 IN;115V 50/60HZ;; 制造商:Pentair Technical Products / Hoffman 功能描述:COOLING FAN 55CFM 15W 制造商:HOFFMAN ENCLOSURES 功能描述:COOLING FAN, 55CFM, 15W 制造商:Pentair Technical Products / Hoffman 功能描述:COOLING FAN, 55CFM, 15W; Enclosure Material:ABS; Body Color:Black; External Height - Imperial:6.29"; External Height - Metric:160mm; External Width - Imperial:7.37"; External Width - Metric:187mm; External Depth - Imperial:2.6" ;RoHS Compliant: Yes |
| TFP410 | 制造商:TI 制造商全称:Texas Instruments 功能描述:TI PANEL BUS DIGITAL TRANSMITTER |
| TFP410-EP | 制造商:TI 制造商全称:Texas Instruments 功能描述:PanelBusa?￠ DIGITAL TRANSMITTER |
| TFP410MPAPREP | 功能描述:显示接口集成电路 PanelBus(TM) Digital Transmitter RoHS:否 制造商:Texas Instruments 电源电流:125 mA 工作温度范围:- 40 C to + 105 C 封装 / 箱体:WQFN-60 封装:Reel |
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