
2111 Comprehensive Drive
Aurora, Illinois 60505
Phone: 630-851-4722
Fax: 630-851-5040
www.conwin.com
Specifications subject to change without notice. All dimensions in inches. Copyright 2007 The Connor-Winfield Corporation
US Headquarters:
630-851-4722
European Headquarters:
+353-61-472221
Bulletin
Page
Revision
Date
Tx189
2of2
04
13 Dec 2007
1
Pad Connections
Package Layout
Suggested Pad Layout
Test Circuit
4
5
1
2 3
6
7
8
9
10
Vcc
TCXO - N/C
VCTCXO - VC
DNC DNC DNC
DNC DNC
.01 uF
Bypass
E/D
Output
10 pF
10Kohm
TABLE 7
Pad
Connection
1
Do not connect
2
Do not connect
3
Do not connect
4
Ground
5
Output
6
Do not connect
7
Do not connect
8
Tri-state Enable / Disable
9
Supply, Vcc
10
Voltage Control (VC) or N/C
OSC
TOP LAYER
GROUND LAYER
BOTTOM LAYER
Output
Buffer
50 Ohm Trace
Without
Vias
.......
Vcc, should have
a large copper
area for reduced
inductance.
Connect a 0.01uF
bypass capacitor
<0.1”(2.54mm)
from the pad.
Ground,
should have
a large copper
area for reduced
inductance.
0.010”(0.254mm)
Recommended
clearance
inductance
for internal
copper flood.
Top View
1
3
4
5
6
8
9
10
Buffer
Ground
50 Ohm trace
<1”by design
Vcc
Ground
Top View
Ordering Information
F
Type:
Precision
TCXO
VCTCXO
5x7mm
Features:
B = TCXO, Clipped Sinewave, 3.3Vdc.
D =
5.0
F=VC
H=VC
5.0
TCXO, Clipped Sinewave,
Vdc.
TCXO, Clipped Sinewave, 3.3Vdc.
TCXO, Clipped Sinewave,
Vdc.
Temperature Range:
5=0to70° C
Frequency Stability:
B = ± 0.10 ppm
Output Frequency:
M = MHz
xxx.xM
T
5
B
019.2M
-
Design Recommendations
Tape and Reel Information
ENVIRONMENTALS
TABLE 6
Vibration:
Vibration per Mil Std 883E Method 2007.3 Test Condition A
Shock:
Mechanical Shock per Mil Std 883E Method 2002.4 Test Condition B.
Soldering:
See solder profile page.
Solderability
Solderability per Mil Std 883E Method 2003
PACKAGE CHARACTERISTICS
TABLE 5
Package
Ceramic Surface Mount Package.
120°C
150°C
180°C
260°C
0
220°C
360 Sec. Max.
120 S
Max.
10 S
60 S
Max.
Time
Temperature
260°C
Solder Profile
Example Part Number: TF5B-019.2M
0.276 0.006
(7.0mm)
±
0.197
0.006
(5.0mm)
±
0.079 Max.
(2.0mm)
0.025(6 Places)
(0.635mm)
0.100
(2.54mm)
0.040
(1.02mm)
(6 Places)
0.030
(0.762mm)
(4 Places)
0.100
(2.54mm)
Pin 1
0.038
(0.965mm)
(4 Places)
TF5B 0716
19.2MHz
Dimensional Tolerance:
±.005 (.127mm)
±.02 (.508mm)
1
23
4
5
6
7
8
9
10
Bottom
View
0.215
(5.46mm)
0.037
(0.94mm)
0.051
(1.28mm)
0.051
(1.28mm)
0.295
(7.49mm)
0.030
(0.76mm)
Keep Out Area
Top View
1
10
9
5
4
8
2
3
6
7
Note:
1) Frequency stability vs. change in temperature. [±(Fmax – Fmin)/2.Fo].
2) Inclusive of calibration @ 25
°C, frequency vs. change in temperature, change in supply
voltage (±5%), load change (±5%), reflow soldering process and 10 years aging
3) For best in application performance, careful selection of an external power source is
critical. Select an external regulator that meets or exceeds to following specifications
regarding voltage regulation tolerance, initial accuracy, temperature coefficient, voltage
noise, and low voltage noise density. Factory Test Conditions: Initial Accuracy ±2mv,
Noise (0.1Hz to 10 KHz) 15uV p-p, Voltage Noise Density = 50nV/sqrt Hz, Temperature
Coefficient < 5ppm/°C.
4) Leave Pad 8 unconnected if enable / disable function is not required. When tri-stated,
the output stage is disabled but the oscillator and compensation circuit are still active
(current consumption < 1mA).
5) Output is AC coupled