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参数资料
| 型号： | TH74KB22B.VWJNGD/T |
| 元件分类： | 模拟信号调理 |
| 英文描述： | SPECIALTY ANALOG CIRCUIT, CQCC84 |
| 封装： | CERAMIC, J LEAD PACKAGE-84 |
| 文件页数： | 5/20页 |
| 文件大小： | 1116K |
| 代理商： | TH74KB22B.VWJNGD/T |
OUTLINE DRAWING
In the standard version devices are hermetically sealed in a Jlead 84 like package with a near IR transparent window (see
next drawing). The package basement includes a thermoelectric cooler and a temperature sensor, see Figures 8-9 for ther-
mal characteristics.
Silicon, with an antireflective coating is the window material. An optional version used an AR coated glass and an additional
frame (numerical aperture f/3) to prevent parasitic lateral visible light.
The photodiode array location is mechanically indexed upon the package rear face (opposite to the window) for fast accu-
rate mounting.
PACKAGE VARIANT (N)
(Thermoelectric cooler version)
13/20
TH7422B
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相关代理商/技术参数 |
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| TH75 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:THERMOCOUPLES |
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| TH7804ACC | 制造商:ATMEL 制造商全称:ATMEL Corporation 功能描述:Linear Charged Couple Device (CCD) Image Sensor 1024 Pixels |
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