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参数资料
| 型号： | THS3061DG4 |
| 厂商： | TEXAS INSTRUMENTS INC |
| 元件分类： | 音频／视频放大 |
| 英文描述： | 1 CHANNEL, VIDEO PREAMPLIFIER, PDSO8 |
| 封装： | GREEN, PLASTIC, MS-012AA, SOIC-8 |
| 文件页数： | 9/33页 |
| 文件大小： | 1015K |
| 代理商： | THS3061DG4 |
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0
0.5
1
1.5
2
2.5
3
3.5
4
–40
–20
0
20
40
60
80
100
θJA = 45.8°C/W
θJA = 58.4°C/W
θJA = 98°C/W
θJA = 158°C/W
–
Maximum
Power
Dissipation
–
W
P
D
TA – Free-Air Temperature – °C
TJ = 125°C
θJA = 45.8°C/W for 8-Pin SOIC w/PowerPad (DDA)
θJA = 58.4°C/W for 8-Pin MSOP w/PowerPad (DGN)
θJA = 98°C/W for 8-Pin SOIC High Test PCB (D)
θJA = 158°C/W for 8-Pin MSOP w/PowerPad w/o Solder
Results are With No Air Flow and PCB Size = 3”x3”
P
Dmax +
Tmax * TA
q
JA
where
PDmax is the maximum power dissipation in the amplifier (W).
Tmax is the absolute maximum junction temperature (°C).
TA is the ambient temperature (°C).
θJA = θJC + θCA
θJC is the thermal coefficient from the silicon junctions to the case (°C/W).
θCA is the thermal coefficient from the case to ambient air (°C/W).
www.ti.com
SLOS394B – JULY 2002 – REVISED NOVEMBER 2009
solder
reflow
operation
as
any
standard
surface-mount component. This results in a
properly-installed device.
POWER DISSIPATION AND
THERMAL CONSIDERATIONS
To maintain maximum output capability, the THS360x
does
not
incorporate
automatic
thermal
shutoff
protection. The designer must ensure that the design
does not violate the absolute maximum junction
temperature of the device. Failure may result if the
absolute maximum junction temperature of +150°C is
exceeded. For best performance, design for a
maximum junction temperature of +125°C. Between
+125°C and +150°C, damage does not occur, but the
performance of the amplifier begins to degrade.
The thermal characteristics of the device are dictated
by the package and the PC board. Maximum power
dissipation for a given package can be calculated
Figure 52. Maximum Power Dissipation
using Equation 1.
vs Ambient Temperature
When determining whether or not the device satisfies
the maximum power dissipation requirement, it is
important not only to consider quiescent power
dissipation, but also dynamic power dissipation.
Often, this is difficult to quantify because the signal
pattern is inconsistent, but an estimate of the RMS
(1)
power dissipation can provide visibility into a possible
For systems where heat dissipation is more critical,
problem.
the THS306x family of devices is offered in an 8-pin
MSOP with PowerPAD, and the THS3062 is available
DRIVING A CAPACITIVE LOAD
in the SOIC-8 PowerPAD package offering even
Driving
capacitive
loads
with
high-performance
better thermal performance. The thermal coefficients
amplifiers is not a problem as long as certain
for
the
PowerPAD
packages
are
substantially
precautions are taken. The first is to realize that the
improved over traditional SOICs. Maximum power
THS306x
has
been
internally
compensated
to
dissipation levels are given in the graph for the
maximize its bandwidth and slew-rate performance.
available
packages.
Data
for
the
PowerPAD
When the amplifier is compensated in this manner,
packages assumes a board layout that follows the
capacitive loading directly on the output decreases
PowerPAD layout guidelines referenced above and
the device's phase margin, leading to high-frequency
detailed in the PowerPAD application note number
ringing or oscillations. Therefore, for capacitive loads
SLMA002. The following graph also illustrates the
of greater than 10 pF, it is recommended that a
effect of not soldering the PowerPAD to a PCB. The
resistor be placed in series with the output of the
thermal impedance increases substantially, which can
amplifier as shown in Figure 53. A minimum value of
cause serious heat and performance issues. Always
10
works well for most applications. For example,
be sure to solder the PowerPAD to the PCB for
in
75-
transmission
systems,
setting
the
optimum performance.
series-resistor value to 75
both isolates any
capacitive loading and provides the proper line
impedance matching at the source end.
Copyright 2002–2009, Texas Instruments Incorporated
17
相关PDF资料 |
PDF描述 |
|---|---|
| THS3061DGNR | 1 CHANNEL, VIDEO PREAMPLIFIER, PDSO8 |
| THS3061DGN | 1 CHANNEL, VIDEO PREAMPLIFIER, PDSO8 |
| THS3061DR | 1 CHANNEL, VIDEO PREAMPLIFIER, PDSO8 |
| THS3061D | 1 CHANNEL, VIDEO PREAMPLIFIER, PDSO8 |
| THS3061DGNG4 | 1 CHANNEL, VIDEO PREAMPLIFIER, PDSO8 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| THS3061DGN | 功能描述:高速运算放大器 Hi-Vltg Hi-Slew-Rate Current Feedback RoHS:否 制造商:Texas Instruments 通道数量:1 电压增益 dB:116 dB 输入补偿电压:0.5 mV 转换速度:55 V/us 工作电源电压:36 V 电源电流:7.5 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
| THS3061DGNG4 | 功能描述:高速运算放大器 Hi-Vltg Hi-Slew-Rate Current Feedback RoHS:否 制造商:Texas Instruments 通道数量:1 电压增益 dB:116 dB 输入补偿电压:0.5 mV 转换速度:55 V/us 工作电源电压:36 V 电源电流:7.5 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
| THS3061DGNR | 功能描述:高速运算放大器 Hi-Vltg Hi-Slew-Rate Current Feedback RoHS:否 制造商:Texas Instruments 通道数量:1 电压增益 dB:116 dB 输入补偿电压:0.5 mV 转换速度:55 V/us 工作电源电压:36 V 电源电流:7.5 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
| THS3061DGNRG4 | 功能描述:高速运算放大器 Hi-Vltg Hi-Slew-Rate Current Feedback RoHS:否 制造商:Texas Instruments 通道数量:1 电压增益 dB:116 dB 输入补偿电压:0.5 mV 转换速度:55 V/us 工作电源电压:36 V 电源电流:7.5 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
| THS3061DR | 功能描述:高速运算放大器 Hi-Vltg Hi-Slew-Rate Current Feedback RoHS:否 制造商:Texas Instruments 通道数量:1 电压增益 dB:116 dB 输入补偿电压:0.5 mV 转换速度:55 V/us 工作电源电压:36 V 电源电流:7.5 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
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