- 您现在的位置：买卖IC网 > PDF目录98220 > THS3062DG4 (TEXAS INSTRUMENTS INC) 1 CHANNEL, VIDEO PREAMPLIFIER, PDSO8 PDF资料下载
参数资料
| 型号： | THS3062DG4 |
| 厂商： | TEXAS INSTRUMENTS INC |
| 元件分类： | 音频／视频放大 |
| 英文描述： | 1 CHANNEL, VIDEO PREAMPLIFIER, PDSO8 |
| 封装： | GREEN, PLASTIC, MS-012AA, SOIC-8 |
| 文件页数： | 8/33页 |
| 文件大小： | 1015K |
| 代理商： | THS3062DG4 |
第1页第2页第3页第4页第5页第6页第7页当前第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页
0.060
0.040
0.075
0.025
0.205
0.010
vias
Pin 1
Top View
0.017
0.035
0.094
0.030
0.013
DIE
Side View (a)
DIE
End View (b)
Thermal
Pad
Bottom View (c)
SLOS394B – JULY 2002 – REVISED NOVEMBER 2009
www.ti.com
leadframe upon which the die is mounted [see
Figure 50(a) and Figure 50(b)]. This arrangement
results in the lead frame being exposed as a thermal
pad
on
the
underside
of
the
package
[see
Figure 50(c)]. Because this thermal pad has direct
thermal contact with the die, excellent thermal
performance can be achieved by providing a good
thermal path away from the thermal pad.
The PowerPAD package allows for both assembly
and thermal management in one manufacturing
operation. During the surface-mount solder operation
(when the leads are being soldered), the thermal pad
can also be soldered to a copper area underneath the
package. Through the use of thermal paths within this
copper area, heat can be conducted away from the
package into either a ground plane or other heat
dissipating device.
Figure 51. DGN PowerPAD PCB Etch
and Via Pattern
The PowerPAD package represents a breakthrough
in combining the small area and ease of assembly of
2. Place five holes in the area of the thermal pad.
surface mount, compared with awkward mechanical
These holes should be 10 mils in diameter. Keep
methods of heatsinking.
them small so that solder wicking through the
holes is not a problem during reflow.
3. Additional vias may be placed anywhere along
the thermal plane outside of the thermal pad
area. This helps dissipate the heat generated by
the THS306x-family IC. These additional vias
may be larger than the 10-mil diameter vias
directly under the thermal pad. They can be
larger because they are not in the thermal pad
area to be soldered, so wicking is not a problem.
Figure 50. Views of Thermally Enhanced Package
4. Connect all holes to the internal ground plane.
5. When connecting these holes to the ground
Although there are many ways to properly heatsink
plane, do not use the typical web or spoke via
the PowerPAD package, the following steps illustrate
connection methodology. Web connections have
the recommended approach.
a high thermal resistance that is useful for
slowing
the
heat
transfer
during
soldering
PowerPAD PCB LAYOUT CONSIDERATIONS
operations, making the soldering of vias that have
1. Prepare the PCB with a top-side etch pattern as
plane connections easier. In this application,
shown in Figure 51. There should be etch for the
however, low thermal resistance is desired for the
leads as well as etch for the thermal pad.
most efficient heat transfer. Therefore, the holes
under the THS306x family PowerPAD package
should make their connection to the internal
ground plane with a complete connection around
the entire circumference of the plated-through
hole.
6. The top-side solder mask should leave the
terminals of the package and the thermal pad
area with its five holes exposed. The bottom-side
solder mask should cover the five holes of the
thermal pad area. This prevents solder from
being pulled away from the thermal pad area
during the reflow process.
7. Apply solder paste to the exposed thermal pad
area and all IC terminals.
8. With these preparatory steps in place, the IC is
simply placed in position and run through the
16
Copyright 2002–2009, Texas Instruments Incorporated
相关PDF资料 |
PDF描述 |
|---|---|
| THS3062DDA | 1 CHANNEL, VIDEO PREAMPLIFIER, PDSO8 |
| THS3062DGN | 1 CHANNEL, VIDEO PREAMPLIFIER, PDSO8 |
| THS3062D | 1 CHANNEL, VIDEO PREAMPLIFIER, PDSO8 |
| THS3062DGNG4 | 1 CHANNEL, VIDEO PREAMPLIFIER, PDSO8 |
| THS3062DDAG3 | 1 CHANNEL, VIDEO PREAMPLIFIER, PDSO8 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| THS3062DGN | 功能描述:高速运算放大器 Hi-Vltg Hi-Slew-Rate Current Feedback RoHS:否 制造商:Texas Instruments 通道数量:1 电压增益 dB:116 dB 输入补偿电压:0.5 mV 转换速度:55 V/us 工作电源电压:36 V 电源电流:7.5 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
| THS3062DGNG4 | 功能描述:高速运算放大器 Hi-Vltg Hi-Slew-Rate Current Feedback RoHS:否 制造商:Texas Instruments 通道数量:1 电压增益 dB:116 dB 输入补偿电压:0.5 mV 转换速度:55 V/us 工作电源电压:36 V 电源电流:7.5 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
| THS3062DGNR | 功能描述:高速运算放大器 Hi-Vltg Hi-Slew-Rate Current Feedback RoHS:否 制造商:Texas Instruments 通道数量:1 电压增益 dB:116 dB 输入补偿电压:0.5 mV 转换速度:55 V/us 工作电源电压:36 V 电源电流:7.5 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
| THS3062DGNRG4 | 功能描述:高速运算放大器 Hi-Vltg Hi-Slew-Rate Current Feedback RoHS:否 制造商:Texas Instruments 通道数量:1 电压增益 dB:116 dB 输入补偿电压:0.5 mV 转换速度:55 V/us 工作电源电压:36 V 电源电流:7.5 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
| THS3062DR | 功能描述:高速运算放大器 Hi-Vltg Hi-Slew-Rate Current Feedback RoHS:否 制造商:Texas Instruments 通道数量:1 电压增益 dB:116 dB 输入补偿电压:0.5 mV 转换速度:55 V/us 工作电源电压:36 V 电源电流:7.5 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
发布紧急采购，3分钟左右您将得到回复。