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参数资料
| 型号： | THS3115IPWPRG4 |
| 厂商： | TEXAS INSTRUMENTS INC |
| 元件分类： | 音频／视频放大 |
| 英文描述： | 1 CHANNEL, VIDEO AMPLIFIER, PDSO14 |
| 封装： | GREEN, PLASTIC, HTSSOP-14 |
| 文件页数： | 10/35页 |
| 文件大小： | 1215K |
| 代理商： | THS3115IPWPRG4 |
第1页第2页第3页第4页第5页第6页第7页第8页第9页当前第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页
-
40
-
20
0
20
40
60
80
100
T
Free-AirTemperature( C)
-
A
°
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
P
MaximumP
owerDissipation(W)
D
Max
-
T =+125
J
C
°
q
=158
/W
JA
C
°
q
=95
/W
JA
C
°
q
=58.4
/W
JA
C
°
SLOS385C – SEPTEMBER 2001 – REVISED SEPTEMBER 2010
www.ti.com
For systems where heat dissipation is more critical,
the THS3115 and THS3112 are also available in an
8-pin MSOP with PowerPAD package that offers
even
better
thermal
performance.
The
thermal
coefficient
for
the
PowerPAD
packages
are
substantially improved over the traditional SOIC.
Maximum power dissipation levels are depicted in
Figure 52 for the available packages. The data for the
PowerPAD packages assume a board layout that
follows the PowerPAD layout guidelines discussed
above and detailed in the PowerPAD application note
(literature
number
also
illustrates the effect of not soldering the PowerPAD to
a
PCB.
The
thermal
impedance
increases
substantially, which may cause serious heat and
performance issues. Always solder the PowerPAD to
Results shown are with no air flow and PCB size of 3 in × 3 in
the PCB for optimum performance.
(76,2 mm × 76,2 mm).
When determining whether or not the device satisfies
qJA = 58.4°C/W for 8-pin MSOP with PowerPAD (DGN
the maximum power dissipation requirement, it is
package)
important to not only consider quiescent power
qJA = 95°C/W for 8-pin SOIC High-K test PCB (D package)
dissipation, but also dynamic power dissipation. Often
qJA = 158°C/W for 8-pin MSOP with PowerPAD without solder
times, this type of dissipation is difficult to quantify
Figure 52. Maximum Power Dissipation vs
because the signal pattern is inconsistent, but an
Ambient Temperature
estimate of the RMS power dissipation can provide
visibility into a possible problem.
18
Copyright 2001–2010, Texas Instruments Incorporated
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相关代理商/技术参数 |
参数描述 |
|---|---|
| THS3120 | 制造商:TI 制造商全称:Texas Instruments 功能描述:LOW-NOISE, HIGH-OUTPUT DRIVE, CURRENT-FEEDBACK, OPERATIONAL AMPLIFIERS |
| THS3120CD | 功能描述:高速运算放大器 Single Lo-Noise Hi-Output RoHS:否 制造商:Texas Instruments 通道数量:1 电压增益 dB:116 dB 输入补偿电压:0.5 mV 转换速度:55 V/us 工作电源电压:36 V 电源电流:7.5 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
| THS3120CDG4 | 功能描述:高速运算放大器 Single Lo-Noise Hi-Output RoHS:否 制造商:Texas Instruments 通道数量:1 电压增益 dB:116 dB 输入补偿电压:0.5 mV 转换速度:55 V/us 工作电源电压:36 V 电源电流:7.5 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
| THS3120CDGN | 功能描述:高速运算放大器 Single Lo-Noise Hi-Output RoHS:否 制造商:Texas Instruments 通道数量:1 电压增益 dB:116 dB 输入补偿电压:0.5 mV 转换速度:55 V/us 工作电源电压:36 V 电源电流:7.5 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
| THS3120CDGNG4 | 功能描述:高速运算放大器 Single Lo-Noise Hi-Output RoHS:否 制造商:Texas Instruments 通道数量:1 电压增益 dB:116 dB 输入补偿电压:0.5 mV 转换速度:55 V/us 工作电源电压:36 V 电源电流:7.5 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
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