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参数资料
| 型号： | THS3120CDR |
| 厂商： | TEXAS INSTRUMENTS INC |
| 元件分类： | 音频／视频放大 |
| 英文描述： | 1 CHANNEL, VIDEO AMPLIFIER, PDSO8 |
| 封装： | GREEN, PLASTIC, MS-012AA, SOIC-8 |
| 文件页数： | 14/34页 |
| 文件大小： | 866K |
| 代理商： | THS3120CDR |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页当前第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页
0.205
(5,21)
0.060
(1,52)
0.013
(0,33)
0.017
(0,432)
0.025
(0,64)
0.094
(2,39)
0.040
(1,01)
0.035
(0,89)
0.075
(1,91)
0.010
vias
(0,254)
0.030
(0,76)
DIE
Side View (a)
DIE
End View (b)
Thermal
Pad
Bottom View (c)
www.ti.com........................................................................................................................................ SLOS420E – SEPTEMBER 2003 – REVISED OCTOBER 2009
PowerPAD DESIGN CONSIDERATIONS
The THS3120 and THS3121 are available in a
thermally-enhanced PowerPAD family of packages.
These packages are constructed using a downset
leadframe upon which the die is mounted (see
Figure 59a and Figure 59b). This arrangement results
in the lead frame being exposed as a thermal pad on
the underside of the package (see Figure 59c).
Because this thermal pad has direct thermal contact
with the die, excellent thermal performance can be
achieved by providing a good thermal path away from
the thermal pad. Note that devices such as the
THS312x have no electrical connection between the
PowerPAD and the die.
The PowerPAD package allows for both assembly
and thermal management in one manufacturing
Dimensions are in inches (millimeters).
operation. During the surface-mount solder operation
Figure 60. DGN PowerPAD PCB Etch and Via
(when the leads are being soldered), the thermal pad
Pattern
can also be soldered to a copper area underneath the
package. Through the use of thermal paths within this
3. Additional vias may be placed anywhere along
copper area, heat can be conducted away from the
the thermal plane outside of the thermal pad
package into either a ground plane or other heat
area. This helps dissipate the heat generated by
dissipating device.
the THS3120/THS3121 IC. These additional vias
may be larger than the 0.01-inch (0,254 mm)
The PowerPAD package represents a breakthrough
diameter vias directly under the thermal pad.
in combining the small area and ease of assembly of
They can be larger because they are not in the
surface
mount
with
the,
heretofore,
awkward
thermal pad area to be soldered so that wicking
mechanical methods of heatsinking.
is not a problem.
4. Connect all holes to the internal ground plane.
Note that the PowerPAD is electrically isolated
from the silicon and all leads. Connecting the
PowerPAD to any potential voltage such as VS–,
is acceptable as there is no electrical connection
to the silicon.
5. When connecting these holes to the ground
plane, do not use the typical web or spoke via
Figure 59. Views of Thermally-Enhanced Package
connection methodology. Web connections have
a high thermal resistance connection that is
useful for slowing the heat transfer during
Although there are many ways to properly heatsink
soldering operations. This makes the soldering of
the PowerPAD package, the following steps illustrate
vias that have plane connections easier. In this
the recommended approach.
application, however, low thermal resistance is
desired for the most efficient heat transfer.
PowerPAD LAYOUT CONSIDERATIONS
Therefore,
the
holes
under
the
1. PCB with a top side etch pattern as shown in
THS3120/THS3121 PowerPAD package should
Figure 60. There should be etch for the leads as
make their connection to the internal ground
well as etch for the thermal pad.
plane with a complete connection around the
2. Place five holes in the area of the thermal pad.
entire circumference of the plated-through hole.
These holes should be 0.01 inch (0,254 mm) in
6. The top-side solder mask should leave the
diameter. Keep them small so that solder wicking
terminals of the package and the thermal pad
through the holes is not a problem during reflow.
area with its five holes exposed. The bottom-side
solder mask should cover the five holes of the
thermal pad area. This prevents solder from
being pulled away from the thermal pad area
during the reflow process.
Copyright 2003–2009, Texas Instruments Incorporated
21
相关PDF资料 |
PDF描述 |
|---|---|
| THS3120CD | 1 CHANNEL, VIDEO AMPLIFIER, PDSO8 |
| THS3120IDG4 | 1 CHANNEL, VIDEO AMPLIFIER, PDSO8 |
| THS3120CDGNR | 1 CHANNEL, VIDEO AMPLIFIER, PDSO8 |
| THS3120CDGN | 1 CHANNEL, VIDEO AMPLIFIER, PDSO8 |
| THS3120IDGNR | 1 CHANNEL, VIDEO AMPLIFIER, PDSO8 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| THS3120CDRG4 | 功能描述:高速运算放大器 Single Lo-Noise Hi-Output RoHS:否 制造商:Texas Instruments 通道数量:1 电压增益 dB:116 dB 输入补偿电压:0.5 mV 转换速度:55 V/us 工作电源电压:36 V 电源电流:7.5 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
| THS3120DGN | 制造商:TI 制造商全称:Texas Instruments 功能描述:LOW-NOISE, HIGH-OUTPUT DRIVE, CURRENT-FEEDBACK, OPERATIONAL AMPLIFIERS |
| THS3120DGNR | 制造商:TI 制造商全称:Texas Instruments 功能描述:LOW-NOISE, HIGH-OUTPUT DRIVE, CURRENT-FEEDBACK, OPERATIONAL AMPLIFIERS |
| THS3120EVM | 功能描述:放大器 IC 开发工具 THS3120 Eval Mod RoHS:否 制造商:International Rectifier 产品:Demonstration Boards 类型:Power Amplifiers 工具用于评估:IR4302 工作电源电压:13 V to 23 V |
| THS3120ID | 功能描述:高速运算放大器 Single Lo-Noise Hi-Output RoHS:否 制造商:Texas Instruments 通道数量:1 电压增益 dB:116 dB 输入补偿电压:0.5 mV 转换速度:55 V/us 工作电源电压:36 V 电源电流:7.5 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
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