参数资料
型号: THS3122CDDAG3
厂商: TEXAS INSTRUMENTS INC
元件分类: 音频/视频放大
英文描述: 1 CHANNEL, VIDEO AMPLIFIER, PDSO8
封装: GREEN, PLASTIC, SOP-8
文件页数: 12/34页
文件大小: 1276K
代理商: THS3122CDDAG3
SLOS382D
– SEPTEMBER 2001 – REVISED FEBRUARY 2011
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
AVAILABLE OPTIONS(1)
PACKAGED DEVICE
EVALUATION
TA
SOIC-8
SOIC-8 PowerPAD
SOIC-14
TSSOP-14
MODULES
(D)
(DDA)
(D)
(PWP)
0
°C to +70°C
THS3122CD
THS3122CDDA
THS3125CD
THS3125CPWP
40
°C to +85°C
THS3122ID
THS3122IDDA
THS3125ID
THS3125IPWP
(1)
For the most current specification and package information, refer to the Package Option Addendum located at the end of this data sheet
or see the TI web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
(1)
Over operating free-air temperature (unless otherwise noted).
UNIT
Supply voltage, VCC+ to VCC–
33 V
Input voltage
±VCC
Output current (see (2))
550 mA
Differential input voltage
±4 V
Maximum junction temperature
+150
°C
Total power dissipation at (or below) +25
°C free-air temperature
Commercial
0
°C to +70°C
Operating free-air temperature, TA
Industrial
–40°C to +85°C
Commercial
–65°C to +125°C
Storage temperature, Tstg
Industrial
–65°C to +125°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
The THS3122 and THS3125 may incorporate a PowerPAD
on the underside of the chip. This pad acts as a heatsink and must be
connected to a thermally dissipating plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction
temperature which could permanently damage the device. See TI Technical Brief SLMA002 for more information about utilizing the
PowerPAD
thermally-enhanced package.
DISSIPATION RATING TABLE
TA = +25°C
PACKAGE
θJA
POWER RATING
D-8
95
°C/W(1)
1.32 W
DDA
67
°C/W
1.87 W
D-14
66.6
°C/W(1)
1.88 W
PWP
37.5
°C/W
3.3 W
(1)
These data were taken using the JEDEC proposed high-K test PCB.
For the JEDEC low-K test PCB, the
θJA is 168°C/W for the D-8
package and 122.3
°C/W for the D-14 package.
2
2001–2011, Texas Instruments Incorporated
Product Folder Link(s): THS3122 THS3125
相关PDF资料
PDF描述
THS3122IDDAG3 1 CHANNEL, VIDEO AMPLIFIER, PDSO8
THS3122IDDARG3 1 CHANNEL, VIDEO AMPLIFIER, PDSO8
THS3122CDDA 1 CHANNEL, VIDEO AMPLIFIER, PDSO8
THS3122CD 1 CHANNEL, VIDEO AMPLIFIER, PDSO8
THS3122IDDA 1 CHANNEL, VIDEO AMPLIFIER, PDSO8
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