- 您现在的位置：买卖IC网 > PDF目录98223 > THS3201DBVTG4 (TEXAS INSTRUMENTS INC) 1 CHANNEL, VIDEO AMPLIFIER, PDSO5 PDF资料下载
参数资料
| 型号： | THS3201DBVTG4 |
| 厂商： | TEXAS INSTRUMENTS INC |
| 元件分类： | 音频／视频放大 |
| 英文描述： | 1 CHANNEL, VIDEO AMPLIFIER, PDSO5 |
| 封装： | GREEN, PLASTIC, SOT-23, 5 PIN |
| 文件页数： | 13/37页 |
| 文件大小： | 1116K |
| 代理商： | THS3201DBVTG4 |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页当前第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页
PowerPAD DESIGN CONSIDERATIONS
0.060
0.040
0.075
0.025
0.205
0.010
vias
Pin 1
Top View
0.017
0.035
0.094
0.030
0.013
PowerPAD PCB LAYOUT CONSIDERATIONS
DIE
Side View (a)
DIE
End View (b)
Thermal
Pad
Bottom View (c)
SLOS416C – JUNE 2003 – REVISED JUNE 2009 ............................................................................................................................................................. www.ti.com
Socketing a high-speed part like the THS3201 is
not recommended. The additional lead length and
pin-to-pin capacitance introduced by the socket
can create an extremely troublesome parasitic
network which can make it almost impossible to
achieve a smooth, stable frequency response.
Best
results
are
obtained
by
soldering
the
THS3201 parts directly onto the board.
The THS3201 is available in a thermally-enhanced
PowerPAD family of packages. These packages are
constructed using a downset leadframe upon which
the
die
is
mounted
[see
62(a)
and
Figure 62(b)]. This arrangement results in the lead
frame being exposed as a thermal pad on the
underside of the package [see Figure 62(c)]. Because
Figure 63. DGN PowerPAD PCB Etch and
this thermal pad has direct thermal contact with the
Via Pattern
die, excellent thermal performance can be achieved
by providing a good thermal path away from the
thermal pad.
The PowerPAD package allows for both assembly
1. Prepare the PCB with a top side etch pattern as
and thermal management in one manufacturing
shown in Figure 63. There should be etch for the
operation. During the surface-mount solder operation
leads as well as etch for the thermal pad.
(when the leads are being soldered), the thermal pad
can also be soldered to a copper area underneath the
2. Place five holes in the area of the thermal pad.
package. Through the use of thermal paths within this
These holes should be 10 mils in diameter. Keep
copper area, heat can be conducted away from the
them small so that solder wicking through the
package into either a ground plane or other heat
holes is not a problem during reflow.
dissipating device.
3. Additional vias may be placed anywhere along
the thermal plane outside of the thermal pad
The PowerPAD package represents a breakthrough
area. This helps dissipate the heat generated by
in combining the small area and ease of assembly of
the THS3201 IC. These additional vias may be
surface-mount
with
the,
heretofore,
awkward
larger than the 10-mil diameter vias directly under
mechanical methods of heatsinking.
the thermal pad. They can be larger because
they are not in the thermal pad area to be
soldered so that wicking is not a problem.
4. Connect all holes to the internal ground plane.
5. When connecting these holes to the ground
plane, do not use the typical web or spoke via
connection methodology. Web connections have
a high thermal resistance connection that is
Figure 62. Views of Thermally-Enhanced Package
useful for slowing the heat transfer during
soldering operations. This makes the soldering of
vias that have plane connections easier. In this
Although there are many ways to properly heatsink
application, however, low thermal resistance is
the PowerPAD package, the following steps illustrate
desired for the most efficient heat transfer.
the recommended approach.
Therefore,
the
holes
under
the
THS3201
PowerPAD
package
should
make
their
connection to the internal ground plane with a
complete
connection
around
the
entire
circumference of the plated-through hole.
6. The top-side solder mask should leave the
terminals of the package and the thermal pad
area with its five holes exposed. The bottom-side
solder mask should cover the five holes of the
thermal pad area. This prevents solder from
20
Copyright 2003–2009, Texas Instruments Incorporated
Product Folder Link(s): THS3201
相关PDF资料 |
PDF描述 |
|---|---|
| THS3201DGKRG4 | 1 CHANNEL, VIDEO AMPLIFIER, PDSO8 |
| THS3201DGNG4 | 1 CHANNEL, VIDEO AMPLIFIER, PDSO8 |
| THS3201DGNRG4 | 1 CHANNEL, VIDEO AMPLIFIER, PDSO8 |
| THS3201MDEP | 1 CHANNEL, VIDEO AMPLIFIER, PDSO8 |
| THS3201MDGNEP | 1 CHANNEL, VIDEO AMPLIFIER, PDSO8 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| THS3201DG4 | 功能描述:高速运算放大器 1.8GHz Current Feedback Amplifier RoHS:否 制造商:Texas Instruments 通道数量:1 电压增益 dB:116 dB 输入补偿电压:0.5 mV 转换速度:55 V/us 工作电源电压:36 V 电源电流:7.5 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
| THS3201DGK | 功能描述:高速运算放大器 1.8GHz Current Feedback Amplifier RoHS:否 制造商:Texas Instruments 通道数量:1 电压增益 dB:116 dB 输入补偿电压:0.5 mV 转换速度:55 V/us 工作电源电压:36 V 电源电流:7.5 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
| THS3201DGKG4 | 功能描述:高速运算放大器 1.8GHz Current Feedback Amplifier RoHS:否 制造商:Texas Instruments 通道数量:1 电压增益 dB:116 dB 输入补偿电压:0.5 mV 转换速度:55 V/us 工作电源电压:36 V 电源电流:7.5 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
| THS3201DGKR | 功能描述:高速运算放大器 1.8GHz Current Feedback Amplifier RoHS:否 制造商:Texas Instruments 通道数量:1 电压增益 dB:116 dB 输入补偿电压:0.5 mV 转换速度:55 V/us 工作电源电压:36 V 电源电流:7.5 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
| THS3201DGKRG4 | 功能描述:高速运算放大器 1.8GHz Current Feedback Amplifier RoHS:否 制造商:Texas Instruments 通道数量:1 电压增益 dB:116 dB 输入补偿电压:0.5 mV 转换速度:55 V/us 工作电源电压:36 V 电源电流:7.5 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
发布紧急采购，3分钟左右您将得到回复。