参数资料
型号: THS3201DGNRG4
厂商: TEXAS INSTRUMENTS INC
元件分类: 音频/视频放大
英文描述: 1 CHANNEL, VIDEO AMPLIFIER, PDSO8
封装: GREEN, PLASTIC, MSOP-8
文件页数: 14/37页
文件大小: 1116K
代理商: THS3201DGNRG4
POWER DISSIPATION AND THERMAL
P
=
DMax
T
Max
-
A
qJA
θJA = 58.4°C/W for 8-Pin MSOP w/PowerPad (DGN)
θJA = 98°C/W for 8-Pin SOIC High Test PCB (D)
θJA = 158°C/W for 8-Pin MSOP w/PowerPad w/o Solder
Results are With No Air Flow and PCB Size = 3”x3”
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
-40
-20
0
20
40
60
80
100
P
D
-
Maximum
Power
Dissipation
-
W
TA - Free-Air Temperature - °C
θJA = 98°C/W
θJA = 158°C/W
TJ = 125°C
θJA = 58.4°C/W
www.ti.com ............................................................................................................................................................. SLOS416C – JUNE 2003 – REVISED JUNE 2009
being pulled away from the thermal pad area
For systems where heat dissipation is more critical,
during the reflow process.
the THS3201 is offered in an 8-pin MSOP with
PowerPAD
and
also
available
in
the
SOIC-8
7. Apply solder paste to the exposed thermal pad
PowerPAD package, offering even better thermal
area and all of the IC terminals.
performance.
The
thermal
coefficients
for
the
8. With these preparatory steps in place, the IC is
PowerPAD packages are substantially improved over
simply placed in position and run through the
the traditional SOIC. Maximum power dissipation
solder
reflow
operation
as
any
standard
levels are depicted in the graph for the available
surface-mount component. This results in a part
packages. The data for the PowerPAD packages
that is properly installed.
assume a board layout that follows the PowerPAD
layout guidelines referenced above and detailed in
the PowerPAD application note number SLMA002.
CONSIDERATIONS
The following graph also illustrates the effect of not
soldering the PowerPAD to a PCB. The thermal
To
maintain
maximum
output
capabilities,
the
impedance increases substantially which may cause
THS3201 does not incorporate automatic thermal
serious heat and performance issues. Be sure to
shutoff protection. The designer must take care to
always solder the PowerPAD to the PCB for optimum
ensure that the design does not violate the absolute
performance.
maximum junction temperature of the device. Failure
may
result
if
the
absolute
maximum
junction
temperature
of
+150°C
is
exceeded.
For
best
performance,
design
for
a
maximum
junction
temperature
of
+125°C.
Between
+125°C
and
+150°C,
damage
does
not
occur,
but
the
performance of the amplifier begins to degrade.
The thermal characteristics of the device are dictated
by the package and the PCB. Maximum power
dissipation for a given package can be calculated
using the following formula.
Where:
P
DMax is the maximum power dissipation in the
amplifier (W)
T
Max is the absolute maximum junction
temperature (°C)
Figure 64. Maximum Power Dissipation
T
A is the ambient temperature (°C)
vs Ambient Temperature
θ
JA = θJC + θCA
θ
JC is the thermal coefficient from the silicon
When determining whether or not the device satisfies
junctions to the case (°C/W)
the maximum power dissipation requirement, it is
θ
CA is the thermal coefficient from the case to the
important to not only consider quiescent power
ambient air (°C/W)
dissipation, but also dynamic power dissipation. Often
times, this is difficult to quantify because the signal
pattern is inconsistent, but an estimate of the RMS
power dissipation can provide visibility into a possible
problem.
Copyright 2003–2009, Texas Instruments Incorporated
21
Product Folder Link(s): THS3201
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