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参数资料
| 型号： | THS4022CIDGN |
| 厂商： | TEXAS INSTRUMENTS INC |
| 元件分类： | 音频／视频放大 |
| 英文描述： | 2 CHANNEL, VIDEO AMPLIFIER, PDSO8 |
| 封装： | GREEN, PLASTIC, MSOP-8 |
| 文件页数： | 6/28页 |
| 文件大小： | 948K |
| 代理商： | THS4022CIDGN |
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www.ti.com
Circuit Layout Considerations
SLOS265C – SEPTEMBER 1999 – REVISED JULY 2007
To achieve the levels of high-frequency performance of the THS402x, follow proper printed-circuit board
high-frequency design techniques. A general set of guidelines is given as follows. In addition, a THS402x
evaluation board is available to use as a guide for layout or for evaluating the device performance.
Ground planes—It is highly recommended that a ground plane be used on the board to provide all
components with a low-inducance ground connection. However, in the areas of the amplifier inputs and
output, the ground plane can be removed to minimize the stray capacitance.
Proper power-supply decoupling—Use a 6.8-μF tantalum capacitor in parallel with a 0.1-μF ceramic capacitor
on each supply terminal. It may be possible to share the tantalum among several amplifiers depending on the
application, but a 0.1-
μF ceramic capacitor should always be used on the supply terminal of every amplifier.
In addition, the 0.1-
μF capacitor should be placed as close as possible to the supply terminal. As this distance
increases, the inductance in the connecting trace makes the capacitor less effective. The designer should
strive for distances of less than 0.1 inch (2.54 mm) between the device power terminals and the ceramic
capacitors.
Sockets—Sockets are not recommended for high-speed operational amplifiers. The additional lead
inductance in the socket pins often produces stability problems. Surface-mount packages soldered directly to
the PCB is the best implementation.
Short trace runs/compact part placements—Optimum high-frequency performance is achieved when stray
series inductance has been minimized. To realize this, the circuit layout should be made as compact as
possible, thereby minimizing the length of all trace runs. Particular attention should be paid to the inverting
input of the amplifier. Its length should be kept as short as possible. This helps to minimize stray capacitance
at the input of the amplifier.
Surface-mount passive components—Using surface-mount passive components is recommended for
high-frequency amplifier circuits for several reasons. First, because of the extremely low lead inductance of
surface-mount components, the problem with stray series inductance is greatly reduced. Second, the small
size of surface-mount components naturally leads to a more compact layout, thereby minimizing both stray
inductance and capacitance. If leaded components are used, it is recommended that the lead lengths be kept
as short as possible.
14
Copyright 1999–2007, Texas Instruments Incorporated
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相关代理商/技术参数 |
参数描述 |
|---|---|
| THS4022D | 制造商:TI 制造商全称:Texas Instruments 功能描述:350-MHz LOW-NOISE HIGH-SPEED AMPLIFIERS |
| THS4022DGN | 制造商:TI 制造商全称:Texas Instruments 功能描述:350-MHz LOW-NOISE HIGH-SPEED AMPLIFIERS |
| THS4022EVM | 功能描述:放大器 IC 开发工具 THS4022 Hi-Spd Amp Eval Mod RoHS:否 制造商:International Rectifier 产品:Demonstration Boards 类型:Power Amplifiers 工具用于评估:IR4302 工作电源电压:13 V to 23 V |
| THS4022ID | 功能描述:高速运算放大器 Dual 350MHz RoHS:否 制造商:Texas Instruments 通道数量:1 电压增益 dB:116 dB 输入补偿电压:0.5 mV 转换速度:55 V/us 工作电源电压:36 V 电源电流:7.5 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
| THS4022IDG4 | 功能描述:高速运算放大器 Dual 350MHz RoHS:否 制造商:Texas Instruments 通道数量:1 电压增益 dB:116 dB 输入补偿电压:0.5 mV 转换速度:55 V/us 工作电源电压:36 V 电源电流:7.5 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
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