参数资料
型号: THS4031EVM
厂商: Texas Instruments
文件页数: 24/47页
文件大小: 0K
描述: EVAL MOD FOR THS4031
标准包装: 1
每 IC 通道数: 1 - 单
放大器类型: 电压反馈
输出类型: 单端
转换速率: 100 V/µs
-3db带宽: 100MHz
电流 - 输出 / 通道: 90mA
工作温度: 0°C ~ 70°C
电流供应(主 IC): 8.5mA
电压 - 电源,单路/双路(±): 9 V ~ 32 V,±4.5 V ~ 16 V
板类型: 完全填充
已供物品:
已用 IC / 零件: THS4031
产品目录页面: 861 (CN2011-ZH PDF)
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其它名称: 296-10029
P
D +
T
MAX
–T
A
q
JA
Where:
PD
= Maximum power dissipation of THS403x IC (watts)
TMAX = Absolute maximum operating junction temperature (125°C)
TA
= Free-ambient air temperature (
°C)
θJA = θJC + θCA
θJC = Thermal coefficient from junction to case
θCA = Thermal coefficient from case to ambient air (°C/W)
MAXIMUMPOWERDISSIPATION
AMBIENTTEMPERATURE
vs
0
0.5
1
1.5
2
2.5
3
-40
-20
0
20
40
60
80
100
TA-Free AirTemperature-°C
MaximumPowerDissipation-W
DGNPackage
=58.4C/W2oz.
TraceandCopperPad
WithSolder
q
JA
T =130C
J
DGNPackage
=158.4C/W2oz.
TraceandCopperPad
WithoutSolder
q
JA
SOICPackage
High-KTestPCB
=98C/W
q
JA
SOICPackage
High-KTestPCB
=166.7C/W
q
JA
SLOS224G – JULY 1999 – REVISED MARCH 2010
www.ti.com
The actual thermal performance achieved with the THS403xDGN in its PowerPAD package depends on the
application. In the example above, if the size of the internal ground plane is approximately 3 inches × 3 inches
(7,62 cm × 7,62 cm), then the expected thermal coefficient, qJA, is about 58.4°C/W. For comparison, the
non-PowerPAD version of the THS403x IC (SOIC) is shown. For a given qJA, the maximum power dissipation
is shown in Figure 62 and is calculated by the following formula:
(3)
Results are with no air flow and PCB size = 3”× 3” (7,62 cm x 7,62 cm)
Figure 62. Maximum Power Dissipation vs Free-Air Temperature
More complete details of the PowerPAD installation process and thermal management techniques can be found
in the Texas Instruments technical brief, PowerPAD Thermally-Enhanced Package (SLMA002). This document
can be found at the TI web site (www.ti.com) by searching on the key word PowerPAD. The document can also
be ordered through your local TI sales office. Refer to literature number SLMA002 when ordering.
The next thing to be considered is package constraints. The two sources of heat within an amplifier are quiescent
power and output power. The designer should never forget about the quiescent heat generated within the device,
especially multiamplifier devices. Because these devices have linear output stages (Class A-B), most of the heat
dissipation is at low output voltages with high output currents. Figure 63 to Figure 66 shows this effect, along with
the quiescent heat, with an ambient air temperature of 50°C. When using VCC = ±5 V, heat is generally not a
problem, even with SOIC packages. But, when using VCC = ±15 V, the SOIC package is severely limited in the
amount of heat it can dissipate. The other key factor when looking at these graphs is how the devices are
mounted on the PCB. The PowerPAD devices are extremely useful for heat dissipation. But, the device should
30
Copyright 1999–2010, Texas Instruments Incorporated
Product Folder Link(s): THS4031 THS4032
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THS4031IDG4 功能描述:高速运算放大器 100-MHz Low Noise Volt-Feedback Amp RoHS:否 制造商:Texas Instruments 通道数量:1 电压增益 dB:116 dB 输入补偿电压:0.5 mV 转换速度:55 V/us 工作电源电压:36 V 电源电流:7.5 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube
THS4031IDGN 功能描述:高速运算放大器 100MHz Low Noise RoHS:否 制造商:Texas Instruments 通道数量:1 电压增益 dB:116 dB 输入补偿电压:0.5 mV 转换速度:55 V/us 工作电源电压:36 V 电源电流:7.5 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube
THS4031IDGNG4 功能描述:高速运算放大器 100-MHz Low Noise Volt-Feedback Amp RoHS:否 制造商:Texas Instruments 通道数量:1 电压增益 dB:116 dB 输入补偿电压:0.5 mV 转换速度:55 V/us 工作电源电压:36 V 电源电流:7.5 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube