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| 型号： | THS4082IDR |
| 厂商： | TEXAS INSTRUMENTS INC |
| 元件分类： | 音频／视频放大 |
| 英文描述： | 1 CHANNEL, VIDEO AMPLIFIER, PDSO8 |
| 封装： | GREEN, PLASTIC, SOIC-8 |
| 文件页数： | 8/32页 |
| 文件大小： | 841K |
| 代理商： | THS4082IDR |
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THS4081, THS4082
175MHz LOW POWER HIGHSPEED AMPLIFIERS
SLOS274D DECEMBER 1999 REVISED JUNE 2001
16
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
APPLICATION INFORMATION
general PowerPAD
design considerations
The THS408x is available packaged in a thermally-enhanced DGN package, which is a member of the
PowerPAD
family of packages. This package is constructed using a downset leadframe upon which the die
is mounted [see Figure 44(a) and Figure 44(b)]. This arrangement results in the lead frame being exposed as
a thermal pad on the underside of the package [see Figure 44(c)]. Because this thermal pad has direct thermal
contact with the die, excellent thermal performance can be achieved by providing a good thermal path away
from the thermal pad.
The PowerPAD
package allows for both assembly and thermal management in one manufacturing operation.
During the surface-mount solder operation (when the leads are being soldered), the thermal pad can also be
soldered to a copper area underneath the package. Through the use of thermal paths within this copper area,
heat can be conducted away from the package into either a ground plane or other heat dissipating device.
The PowerPAD
package represents a breakthrough in combining the small area and ease of assembly of the
surface mount with the, heretofore, awkward mechanical methods of heatsinking.
DIE
Side View (a)
End View (b)
Bottom View (c)
DIE
Thermal
Pad
NOTE A: The thermal pad is electrically isolated from all terminals in the package.
Figure 44. Views of Thermally Enhanced DGN Package
相关PDF资料 |
PDF描述 |
|---|---|
| THS4082ID | 1 CHANNEL, VIDEO AMPLIFIER, PDSO8 |
| THS4082CDGNRG4 | 1 CHANNEL, VIDEO AMPLIFIER, PDSO8 |
| THS4082IDGNRG4 | 1 CHANNEL, VIDEO AMPLIFIER, PDSO8 |
| THS4082CDRG4 | 1 CHANNEL, VIDEO AMPLIFIER, PDSO8 |
| THS4082IDG4 | 1 CHANNEL, VIDEO AMPLIFIER, PDSO8 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| THS4082IDRG4 | 功能描述:高速运算放大器 175-MHz Low-Power Vltg-Feedback Dual RoHS:否 制造商:Texas Instruments 通道数量:1 电压增益 dB:116 dB 输入补偿电压:0.5 mV 转换速度:55 V/us 工作电源电压:36 V 电源电流:7.5 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
| THS412 | 制造商:TI 制造商全称:Texas Instruments 功能描述:200MHz, CMOS OPERATIONAL AMPLIFIER WITH SHUTDOWN |
| THS4120 | 制造商:TI 制造商全称:Texas Instruments 功能描述:HIGH-SPEED FULLY DIFFERENTIAL I/O AMPLIFIERS |
| THS4120CD | 功能描述:特殊用途放大器 Fully Differential CMOS RoHS:否 制造商:Texas Instruments 通道数量:Single 共模抑制比（最小值）: 输入补偿电压: 工作电源电压:3 V to 5.5 V 电源电流:5 mA 最大功率耗散: 最大工作温度:+ 70 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:QFN-20 封装:Reel |
| THS4120CDG4 | 功能描述:特殊用途放大器 3.3V 100 MHz 43 V/us Fully Diff CMOS Amp RoHS:否 制造商:Texas Instruments 通道数量:Single 共模抑制比（最小值）: 输入补偿电压: 工作电源电压:3 V to 5.5 V 电源电流:5 mA 最大功率耗散: 最大工作温度:+ 70 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:QFN-20 封装:Reel |
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