- 您现在的位置：买卖IC网 > PDF目录98226 > THS4271DGKRG4 (TEXAS INSTRUMENTS INC) 1 CHANNEL, VIDEO PREAMPLIFIER, PDSO8 PDF资料下载
参数资料
| 型号： | THS4271DGKRG4 |
| 厂商： | TEXAS INSTRUMENTS INC |
| 元件分类： | 音频／视频放大 |
| 英文描述： | 1 CHANNEL, VIDEO PREAMPLIFIER, PDSO8 |
| 封装： | GREEN, PLASTIC, MSOP-8 |
| 文件页数： | 22/48页 |
| 文件大小： | 1227K |
| 代理商： | THS4271DGKRG4 |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页当前第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页
Single or Dual
68 Mils x 70 Mils
(Via diameter = 13mils)
DIE
Side View (a)
DIE
End View (b)
Thermal
Pad
Bottom View (c)
www.ti.com
SLOS397F – JULY 2002 – REVISED OCTOBER 2009
5. Socketing a high speed part like the THS4271
PowerPAD PCB LAYOUT CONSIDERATIONS
is not recommended. The additional lead length
1. Prepare the PCB with a top side etch pattern as
and pin-to-pin capacitance introduced by the
shown in Figure 90. There should be etch for the
socket
can
create
a
troublesome
parasitic
leads as well as etch for the thermal pad.
network which can make it almost impossible to
achieve a smooth, stable frequency response.
Best results are obtained by soldering the
THS4271 onto the board.
PowerPAD DESIGN CONSIDERATIONS
The THS4271 and THS4275 are available in a
thermally-enhanced PowerPAD family of packages.
These packages are constructed using a downset
Figure 90. PowerPAD PCB Etch
leadframe upon which the die is mounted [see
and Via Pattern
Figure 89(a) and Figure 89(b)]. This arrangement
results in the lead frame being exposed as a thermal
2. Place five holes in the area of the thermal pad.
pad
on
the
underside
of
the
package
[see
The holes should be 13 mils in diameter. Keep
Figure 89(c)]. Because this thermal pad has direct
them small so that solder wicking through the
thermal contact with the die, excellent thermal
holes is not a problem during reflow.
performance can be achieved by providing a good
3. Additional vias may be placed anywhere along
thermal path away from the thermal pad.
the thermal plane outside of the thermal pad
area. They help dissipate the heat generated by
The PowerPAD package allows both assembly and
the THS4271 and THS4275 IC. These additional
thermal management in one manufacturing operation.
vias may be larger than the 13-mil diameter vias
During the surface-mount solder operation (when the
directly under the thermal pad. They can be
leads are being soldered), the thermal pad can also
larger because they are not in the thermal pad
be soldered to a copper area underneath the
area to be soldered, so that wicking is not a
package. Through the use of thermal paths within this
problem.
copper area, heat can be conducted away from the
4. Connect all holes to the internal ground plane.
package into either a ground plane or other heat
5. When connecting these holes to the ground
dissipating device.
plane, do not use the typical web or spoke via
The PowerPAD package represents a breakthrough
connection methodology. Web connections have
in combining the small area and ease of assembly of
a high thermal resistance connection that is
surface
mount
with
the
heretofore
awkward
useful for slowing the heat transfer during
mechanical methods of heatsinking.
soldering operations. This resistance makes the
soldering of vias that have plane connections
easier. In this application, however, low thermal
resistance is desired for the most efficient heat
transfer. Therefore, the holes under the THS4271
and THS4275 PowerPAD package should make
their connection to the internal ground plane, with
a
complete
connection
around
the
entire
circumference of the plated-through hole.
6. The top-side solder mask should leave the
Figure 89. Views of Thermally
terminals of the package and the thermal pad
Enhanced Package
area with its five holes exposed. The bottom-side
solder mask should cover the five holes of the
thermal pad area. This prevents solder from
Although there are many ways to properly heatsink
being pulled away from the thermal pad area
the PowerPAD package, the following steps illustrate
during the reflow process.
the recommended approach.
7. Apply solder paste to the exposed thermal pad
space
area and all of the IC terminals.
space
8. With these preparatory steps in place, the IC is
simply placed in position and run through the
space
solder
reflow
operation
as
any
standard
space
surface-mount component. This results in a part
that is properly installed.
Copyright 2002–2009, Texas Instruments Incorporated
29
相关PDF资料 |
PDF描述 |
|---|---|
| THS4271DGNRG4 | 1 CHANNEL, VIDEO PREAMPLIFIER, PDSO8 |
| THS4271DRB | VIDEO AMPLIFIER, PDSO8 |
| THS4275DRB | VIDEO AMPLIFIER, PDSO8 |
| THS4271MDEP | 1 CHANNEL, VIDEO AMPLIFIER, PDSO8 |
| THS4271MDGNTEP | 1 CHANNEL, VIDEO AMPLIFIER, PDSO8 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| THS4271DGN | 功能描述:高速运算放大器 Super-Fast Ultra-Low Distortion RoHS:否 制造商:Texas Instruments 通道数量:1 电压增益 dB:116 dB 输入补偿电压:0.5 mV 转换速度:55 V/us 工作电源电压:36 V 电源电流:7.5 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
| THS4271DGN | 制造商:Texas Instruments 功能描述:IC SM OP-AMP HI-SPEED VFB |
| THS4271DGN | 制造商:Texas Instruments 功能描述:OP AMP HIGH SPEED VFB HTSSOP 427 |
| THS4271DGNG4 | 功能描述:高速运算放大器 Super-Fast Ultra-Low Distortion RoHS:否 制造商:Texas Instruments 通道数量:1 电压增益 dB:116 dB 输入补偿电压:0.5 mV 转换速度:55 V/us 工作电源电压:36 V 电源电流:7.5 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
| THS4271DGNR | 功能描述:高速运算放大器 Super-Fast Ultra-Low Distortion RoHS:否 制造商:Texas Instruments 通道数量:1 电压增益 dB:116 dB 输入补偿电压:0.5 mV 转换速度:55 V/us 工作电源电压:36 V 电源电流:7.5 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
发布紧急采购，3分钟左右您将得到回复。