参数资料
| 型号： | TISP3180H3SL |
| 厂商： | Bourns Inc. |
| 文件页数： | 11/11页 |
| 文件大小： | 0K |
| 描述： | SURGE SUPP 145V BIDIR 3-SL |
| 产品变化通告： | Product Obsolescence Jun/2008 |
| 标准包装： | 50 |
| 电压 - 击穿： | 180V |
| 电压 - 断路： | 145V |
| 电压 - 导通状态： | 3V |
| 电流 - 峰值脉冲(8 x 20µs)： | 300A |
| 电流 - 峰值脉冲(10 x 1000µs)： | 100A |
| 电流 - 保持 (Ih)： | 150mA |
| 元件数： | 2 |
| 电容： | 74pF |
| 封装/外壳： | 径向 - 3 引线 |
| 包装： | 管件 |
TISP3xxxH3SL Overvoltage Protector Series
APPLICATIONS INFORMATION
Normal System Voltage Levels (continued)
For the extreme case of an unconnected line, the temperature at which clipping begins can be calculated using the data from Figure 9.
To possibly clip, the V DRM value has to be 206.5 V. This is a reduction of the 220 V 25 °C V DRM value by a factor of 206.5/220 = 0.94.
Figure 9 shows that a 0.94 reduction will occur at an ambient temperature of -32 °C. In this example, the TISP3290H3 will allow normal
equipment operation, even on an open-circuit line, provided that the minimum expected ambient temperature does not fall below -32 °C.
JESD51 Thermal Measurement Method
To standardize thermal measurements, the EIA (Electronic Industries Alliance) has created the JESD51 standard. Part 2 of the standard
(JESD51-2, 1995) describes the test environment. This is a 0.0283 m 3 (1 ft 3 ) cube which contains the test PCB (Printed Circuit Board)
horizontally mounted at the center. Part 3 of the standard (JESD51-3, 1996) defines two test PCBs for surface mount components; one
for packages smaller than 27 mm (1.06 ”) on a side and the other for packages up to 48 mm (1.89 ”). The thermal measurements used
the smaller 76.2 mm x 114.3 mm (3.0 ” x 4.5 ”) PCB. The JESD51-3 PCBs are designed to have low effective thermal conductivity (high
thermal resistance) and represent a worse case condition. The PCBs used in the majority of applications will achieve lower values of
thermal resistance and so can dissipate higher power levels than indicated by the JESD51 values.
“TISP” is a trademark of Bourns, Ltd., a Bourns Company, and is Registered in U.S. Patent and Trademark Office.
“Bourns” is a registered trademark of Bourns, Inc. in the U.S. and other countries.
JANUARY 1999 - REVISED JANUARY 2007
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| TISP3180H3SLS | 制造商:Bourns Inc 功能描述: |
| TISP3180H3SL-S | 功能描述:硅对称二端开关元件 Dual Bidirectional overvolt protecter RoHS:否 制造商:Bourns 转折电流 VBO:40 V 最大转折电流 IBO:800 mA 不重复通态电流: 额定重复关闭状态电压 VDRM:25 V 关闭状态漏泄电流（在 VDRM IDRM 下）: 保持电流（Ih 最大值）:50 mA 开启状态电压:5 V 关闭状态电容 CO:120 pF 最大工作温度:+ 150 C 安装风格:SMD/SMT 封装 / 箱体:DO-214AA |
| TISP3180L | 功能描述:硅对称二端开关元件 RoHS:否 制造商:Bourns 转折电流 VBO:40 V 最大转折电流 IBO:800 mA 不重复通态电流: 额定重复关闭状态电压 VDRM:25 V 关闭状态漏泄电流（在 VDRM IDRM 下）: 保持电流（Ih 最大值）:50 mA 开启状态电压:5 V 关闭状态电容 CO:120 pF 最大工作温度:+ 150 C 安装风格:SMD/SMT 封装 / 箱体:DO-214AA |
| TISP3180LS | 制造商:Bourns Inc 功能描述: |
| TISP3180L-S | 功能描述:硅对称二端开关元件 Dual bidirectional protector RoHS:否 制造商:Bourns 转折电流 VBO:40 V 最大转折电流 IBO:800 mA 不重复通态电流: 额定重复关闭状态电压 VDRM:25 V 关闭状态漏泄电流（在 VDRM IDRM 下）: 保持电流（Ih 最大值）:50 mA 开启状态电压:5 V 关闭状态电容 CO:120 pF 最大工作温度:+ 150 C 安装风格:SMD/SMT 封装 / 箱体:DO-214AA |
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