参数资料
型号: TISP3260F3DR
厂商: Bourns Inc.
文件页数: 3/12页
文件大小: 0K
描述: SURGE SUPP 200V BIDIR 8-SOIC
标准包装: 2,500
电压 - 击穿: 260V
电压 - 断路: 200V
电压 - 导通状态: 3V
电流 - 峰值脉冲(8 x 20µs): 120A
电流 - 峰值脉冲(10 x 1000µs): 35A
电流 - 保持 (Ih): 150mA
元件数: 2
电容: 45pF
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
包装: 带卷 (TR)
TISP3xxxF3 (HV) Overvoltage Protector Series
Electrical Characteristics for T and G or R and G Terminals, T A = 25 °C (Unless Otherwise Noted)
I DRM
Parameter
Repetitive peak off-
state current
Test Conditions
V D = ± V DRM , 0 ° C < T A < 70 ° C
Min
Typ
Max
± 10
Unit
μ A
‘3240F3
‘3260F3
± 240
± 260
V (BO)
Breakover voltage
dv/dt = ± 250 V/ms, R SOURCE = 300 ?
‘3290F3
± 290
V
‘3320F3
‘3380F3
‘3240F3
± 267
± 320
± 380
V (BO)
Impulse breakover
voltage
dv/dt ≤ ± 1000 V/ μ s, Linear voltage ramp,
Maximum ramp value = ± 500 V
R SOURCE = 50 ?
‘3260F3
‘3290F3
‘3320F3
± 287
± 317
± 347
V
‘3380F3
± 407
I (BO)
Breakover current
dv/dt = ± 250 V/ms, R SOURCE = 300 ?
± 0.1
± 0.6
A
V T
I H
dv/dt
I D
On-state voltage
Holding current
Critical rate of rise of
off-state voltage
Off-state current
I T = ± 5 A, t W = 100 μ s
I T = ± 5 A, di/dt = -/+30 mA/ms
Linear voltage ramp, Maximum ramp value < 0.85V DRM
V D = ± 50 V
f = 1 MHz, V d = 0.1 V r.m.s., V D = 0
± 0.15
± 5
57
± 3
± 10
95
V
A
kV/ μ s
μ A
C off
Off-state capacitance
f = 1 MHz, V d = 0.1 V r.m.s., V D = -5 V
f = 1 MHz, V d = 0.1 V r.m.s., V D = -50 V
26
11
45
20
pF
(see Notes 5 and 6)
NOTES: 6 These capacitance measurements employ a three terminal capacitance bridge incorporating a guard circuit. The third terminal is
connected to the guard terminal of the bridge.
7. Further details on capacitance are given in the Applications Information section.
Thermal Characteristics
R θ JA
Parameter
Junction to free air thermal resistance
Test Conditions
P tot = 0.8 W, T A = 25 ° C
5 cm 2 , FR4 PCB
Min
Typ
Max
160
Unit
° C/W
MARCH 1994 - REVISED SEPTEMBER 2008
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
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TISP3260F3DR-S 功能描述:硅对称二端开关元件 High Volt Dual Bidirectional RoHS:否 制造商:Bourns 转折电流 VBO:40 V 最大转折电流 IBO:800 mA 不重复通态电流: 额定重复关闭状态电压 VDRM:25 V 关闭状态漏泄电流(在 VDRM IDRM 下): 保持电流(Ih 最大值):50 mA 开启状态电压:5 V 关闭状态电容 CO:120 pF 最大工作温度:+ 150 C 安装风格:SMD/SMT 封装 / 箱体:DO-214AA
TISP3260F3P 功能描述:硅对称二端开关元件 High Volt Dual Bidirectional RoHS:否 制造商:Bourns 转折电流 VBO:40 V 最大转折电流 IBO:800 mA 不重复通态电流: 额定重复关闭状态电压 VDRM:25 V 关闭状态漏泄电流(在 VDRM IDRM 下): 保持电流(Ih 最大值):50 mA 开启状态电压:5 V 关闭状态电容 CO:120 pF 最大工作温度:+ 150 C 安装风格:SMD/SMT 封装 / 箱体:DO-214AA
TISP3260F3PS 制造商:Bourns Inc 功能描述:
TISP3260F3P-S 功能描述:硅对称二端开关元件 High Volt Dual Bidirectional RoHS:否 制造商:Bourns 转折电流 VBO:40 V 最大转折电流 IBO:800 mA 不重复通态电流: 额定重复关闭状态电压 VDRM:25 V 关闭状态漏泄电流(在 VDRM IDRM 下): 保持电流(Ih 最大值):50 mA 开启状态电压:5 V 关闭状态电容 CO:120 pF 最大工作温度:+ 150 C 安装风格:SMD/SMT 封装 / 箱体:DO-214AA
TISP3260F3SL 功能描述:硅对称二端开关元件 High Volt Dual Bidirectional RoHS:否 制造商:Bourns 转折电流 VBO:40 V 最大转折电流 IBO:800 mA 不重复通态电流: 额定重复关闭状态电压 VDRM:25 V 关闭状态漏泄电流(在 VDRM IDRM 下): 保持电流(Ih 最大值):50 mA 开启状态电压:5 V 关闭状态电容 CO:120 pF 最大工作温度:+ 150 C 安装风格:SMD/SMT 封装 / 箱体:DO-214AA