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参数资料
| 型号： | TJ3-1U1.2UH20% |
| 厂商： | VISHAY DALE |
| 元件分类： | 通用定值电感 |
| 英文描述： | 1 ELEMENT, 1.19 uH, GENERAL PURPOSE INDUCTOR |
| 封装： | RADIAL LEADED |
| 文件页数： | 1/8页 |
| 文件大小： | 137K |
TJ
Vishay Dale
Document Number 34079
Revision 16-Nov-04
For technical questions, contact Magnetics@vishay.com
www.vishay.com
49
Inductors
Toroid, High Current
FEATURES
Printed circuit mounting.
Wide range of inductance and current ratings.
Toroid design reduces EMI.
Vertical or horizontal mounting to optimize P.C. Board layout.
DIMENSIONS in inches [millimeters]
Vertical Mount
(Mounting/Coating Code - 1U)
Horizontal Mount
(Mounting/Coating Code - 2U)
*On larger units and units with finer wire, additional mechanical mounting is recommended. **Leads stripped to within .062" [1.58mm] of the coil.
MODEL
TJ3
TJ4
TJ5
TJ6
TJ7
TJ8
TJ9
MODEL
TJ3
TJ4
TJ5
TJ6
TJ7
TJ8
TJ9
DIAMETER (D)
(Max.)
0.65
[16.5]
0.88
[22.4]
1.00
[25.4]
1.38
[35.1]
1.65
[41.9]
1.92
[48.8]
2.66
[67.6]
HEIGHT (H)
(Max.)
0.30
[7.6]
0.40
[10.2]
0.45
[11.4]
0.83
[21.1]
0.75
[19.1]
1.00
[25.4]
1.42
[36.1]
NOMINAL
LEAD SPACING
(Ls)
0.26 ± 0.04
[6.60 ± 1.02]
0.31 ± 0.09
[7.87 ± 2.29]
0.37 ± 0.08
[9.40 ± 2.03]
0.73 ± 0.10
[18.5 ± 2.54]
0.62 ± 0.13
[15.8 ± 3.30]
0.82 ± 0.18
[20.8 ± 4.57]
1.25 ± 0.17
[31.8 ± 4.32]
NOMINAL
LEAD
DIAMETER
(Ld)
See TJ3
Data
See TJ4
Data
See TJ5
Data
See TJ6
Data
See TJ7
Data
See TJ8
Data
See TJ9
Data
DIAMETER (D)
(Max.)
0.66
[16.8]
0.88
[22.4]
1.00
[25.4]
1.38
[35.1]
1.65
[41.9]
1.94
[49.3]
2.72
[69.1]
HEIGHT (H)
(Max.)
0.32
[8.1]
0.40
[10.2]
0.45
[11.4]
0.83
[21.1]
0.75
[19.1]
1.00
[25.4]
1.42
[36.1]
NOMINAL
LEAD SPACING
(Ls)
0.58 ± 0.08
[14.7 ± 2.03]
0.78 ± 0.10
[19.8 ± 2.54]
0.90 ± 0.10
[22.9 ± 2.54]
1.22 ± 0.16
[31.0 ± 4.06]
1.48 ± 0.17
[37.6 ± 4.32]
1.76 ± 0.18
[44.7 ± 4.57]
2.49 ± 0.23
[63.2 ± 5.84]
NOMINAL
LEAD
DIAMETER
(Ld)
See TJ3
Data
See TJ4
Data
See TJ5
Data
See TJ6
Data
See TJ7
Data
See TJ8
Data
See TJ9
Data
D
0.062**
[1.58]
Max.
0.500
[12.7]
Min.
Ls
Ld
Part
Marking
H
Hot Solder Dip
Leads
H
D
0.062**
[1.58]
Max.
0.500 [12.7]
Min.
Ls
Ld
Hot Solder Dip
Leads
Part
Marking
TEST
Thermal Shock
Resistance to Soldering Heat
Solderability
CONDITIONS
Test Condition B1
—
SPECIFICATIONS
MIL-STD-202, Method 107
MIL-STD-202, Method 210
MIL-STD-202, Method 208
ENVIRONMENTAL PERFORMANCE
APPLICATIONS
Switching power supplies, EMI/RFI filtering, output chokes.
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