PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
LCCC
CDIP
SOIC
Package
Drawing
FK
J
D
Pins Package
Qty
1
1
50
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
5962-89503022A
5962-8950302CA
TLC556CD
ACTIVE
ACTIVE
ACTIVE
20
14
14
None
None
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
None
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
None
None
None
None
None
None
None
POST-PLATE
A42 SNPB
CU NIPDAU
Level-NC-NC-NC
Level-NC-NC-NC
Level-2-260C-1YEAR/
Level-1-220C-UNLIM
Level-2-260C-1YEAR/
Level-1-220C-UNLIM
Level-2-260C-1YEAR/
Level-1-220C-UNLIM
Level-2-260C-1YEAR/
Level-1-220C-UNLIM
Level-NC-NC-NC
TLC556CDG4
ACTIVE
SOIC
D
14
50
CU NIPDAU
TLC556CDR
ACTIVE
SOIC
D
14
2500
CU NIPDAU
TLC556CDRG4
ACTIVE
SOIC
D
14
2500
CU NIPDAU
TLC556CN
ACTIVE
PDIP
N
14
25
CU NIPD
TLC556CNE4
TLC556ID
ACTIVE
ACTIVE
PDIP
SOIC
N
D
14
14
25
50
Call TI
CU NIPDAU
Call TI
Level-2-260C-1YEAR/
Level-1-220C-UNLIM
Level-2-260C-1YEAR/
Level-1-220C-UNLIM
Level-NC-NC-NC
TLC556IDR
ACTIVE
SOIC
D
14
2500
CU NIPDAU
TLC556IN
ACTIVE
PDIP
N
14
25
CU NIPD
TLC556INE4
TLC556MD
TLC556MDR
TLC556MFKB
TLC556MJ
TLC556MJB
TLC556MN
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
OBSOLETE
PDIP
SOIC
SOIC
LCCC
CDIP
CDIP
PDIP
N
D
D
FK
J
J
N
14
14
14
20
14
14
14
25
50
1
1
1
1
Call TI
CU NIPDAU
CU NIPDAU
POST-PLATE
A42 SNPB
A42 SNPB
Call TI
Call TI
Level-1-220C-UNLIM
Level-1-220C-UNLIM
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Call TI
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check
for the latest availability information and additionalproduct content details.
None:
Not yet available Lead (Pb-Free).
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:
The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
PACKAGE OPTION ADDENDUM
www.ti.com
11-Mar-2005
Addendum-Page 1