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参数资料
型号： TLE2024AMFK
厂商： TEXAS INSTRUMENTS INC
元件分类： 运算放大器
英文描述： QUAD OP-AMP, 950 uV OFFSET-MAX, 2.8 MHz BAND WIDTH, CQCC20
封装： CERAMIC, LCC-20
文件页数： 12/76页
文件大小： 1586K
代理商： TLE2024AMFK
TLE202x, TLE202xA, TLE202xB, TLE202xY
EXCALIBUR HIGH-SPEED LOW-POWER PRECISION
OPERATIONAL AMPLIFIERS
SLOS191D FEBRUARY 1997 REVISED NOVEMBER 2010
2
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
TLE2021 AVAILABLE OPTIONS
PACKAGED DEVICES
CHIP
TA
VIOmax
AT 25°C
SMALL
OUTLINE
(D)
SSOP
(DB)
CHIP
CARRIER
(FK)
CERAMIC DIP
(JG)
PLASTIC DIP
(P)
TSSOP
(PW)
CHIP
FORM§
(Y)
0°C to
200 μV
TLE2021ACD
TLE2021CDBLE
TLE2021ACP
—
0 C to
70°C
200 μV
500 μV
TLE2021ACD
TLE2021CD
TLE2021CDBLE
—
TLE2021ACP
TLE2021CP
TLE2021CPWLE TLE2021Y
40°C
to
200 μV
TLE2021AID
TLE2021AIP
to
85°C
200 μV
500 μV
TLE2021AID
TLE2021ID
—
TLE2021AIP
TLE2021IP
—
55°C
100 V
TLE2021BMFK TLE2021BMJG
55 C
to
100 μV
500 μV
—
TLE2021MD
—
TLE2021BMFK
TLE2021MFK
TLE2021BMJG
TLE2021MJG
—
TLE2021MP
—
to
125°C
500 μV
TLE2021MD
TLE2021MFK
TLE2021MJG
TLE2021MP
The D packages are available taped and reeled. To order a taped and reeled part, add the suffix R (e.g., TLE2021CDR).
The DB and PW packages are only available left-end taped and reeled.
§ Chip forms are tested at 25°C only.
TLE2022 AVAILABLE OPTIONS
PACKAGED DEVICES
CHIP
TA
VIOmax
AT 25°C
SMALL
OUTLINE
(D)
SSOP
(DB)
CHIP
CARRIER
(FK)
CERAMIC
DIP
(JG)
PLASTIC
DIP
(P)
TSSOP
(PW)
CHIP
FORM§
(Y)
0°C
to
150 μV
300 μV
TLE2022BCD
TLE2022ACD
—
TLE2022ACP
—
to
70°C
300 μV
500 μV
TLE2022ACD
TLE2022CD
—
TLE2022CDBLE
—
TLE2022ACP
TLE2022CP
—
TLE2022CPWLE
—
TLE2022Y
40°C
to
150 μV
300 μV
TLE2022BID
TLE2022AID
—
TLE2022AIP
to
85°C
300 μV
500 μV
TLE2022AID
TLE2022ID
—
TLE2022AIP
TLE2022IP
—
55°C
150 μV
—
TLE2022BMJG
—
55 C
to
150 μV
300 μV
—
TLE2022AMD
—
TLE2022AMFK
TLE2022BMJG
TLE2022AMJG
—
TLE2022AMP
—
to
125°C
300 μV
500 μV
TLE2022AMD
TLE2022MD
TLE2022AMFK
TLE2022MFK
TLE2022AMJG
TLE2022MJG
TLE2022AMP
TLE2022MP
The D packages are available taped and reeled. To order a taped and reeled part, add the suffix R (e.g., TLE2022CDR).
The DB and PW packages are only available left-end taped and reeled.
§ Chip forms are tested at 25°C only.
TLE2024 AVAILABLE OPTIONS
PACKAGED DEVICES
CHIP
TA
VIOmax
AT 25°C
SMALL
OUTLINE
(DW)
CHIP
CARRIER
(FK)
CERAMIC
DIP
(J)
PLASTIC
DIP
(N)
CHIP
FORM§
(Y)
500 μV TLE2024BCDW
TLE2024BCN
—
0°C to 70
°C
500 μV
750 μV
TLE2024BCDW
TLE2024ACDW
—
TLE2024BCN
TLE2024ACN
—
0 C to 70 C
750 μV
1000 μV
TLE2024ACDW
TLE2024CDW
TLE2024ACN
TLE2024CN
TLE2024Y
500 μV TLE2024BIDW
TLE2024BIN
40°C to 85°C
500 μV
750 μV
TLE2024BIDW
TLE2024AIDW
—
TLE2024BIN
TLE2024AIN
—
40 C to 85 C
750 μV
1000 μV
TLE2024AIDW
TLE2024IDW
TLE2024AIN
TLE2024IN
500 μV TLE2024BMDW
TLE2024BMFK
TLE2024BMJ
TLE2024BMN
55°C to 125°C
500 μV
750 μV
TLE2024BMDW
TLE2024AMDW
TLE2024BMFK
TLE2024AMFK
TLE2024BMJ
TLE2024AMJ
TLE2024BMN
TLE2024AMN
—
55 C to 125 C
750 μV
1000 μV
TLE2024AMDW
TLE2024MDW
TLE2024AMFK
TLE2024MFK
TLE2024AMJ
TLE2024MJ
TLE2024AMN
TLE2024MN
§ Chip forms are tested at 25°C only.
相关PDF资料
PDF描述
TLE2024Y QUAD OP-AMP, 1000 uV OFFSET-MAX, 1.7 MHz BAND WIDTH, UUC14
TLE2037AIDR OP-AMP, 105 uV OFFSET-MAX, 50 MHz BAND WIDTH, PDSO8
TLE2037AMDR OP-AMP, 105 uV OFFSET-MAX, 50 MHz BAND WIDTH, PDSO8
TLE2037ACDR OP-AMP, 70 uV OFFSET-MAX, 50 MHz BAND WIDTH, PDSO8
TLE2037MDR OP-AMP, 200 uV OFFSET-MAX, 50 MHz BAND WIDTH, PDSO8
相关代理商/技术参数
参数描述
TLE2024AMFKB 制造商:Rochester Electronics LLC 功能描述: 制造商:Texas Instruments 功能描述: 制造商:Texas Instruments 功能描述:OP Amp Quad GP 20V/40V 20-Pin LCCC Tube
TLE2024AMJ 制造商:TI 制造商全称:Texas Instruments 功能描述:EXCALIBUR HIGH-SPEED LOW-POWER PRECISION OPERATIONAL AMPLIFIERS
TLE2024AMJB 制造商:TI 制造商全称:Texas Instruments 功能描述:EXCALIBUR HIGH-SPEED LOW-POWER PRECISION OPERATIONAL AMPLIFIERS
TLE2024AMN 制造商:Rochester Electronics LLC 功能描述:- Bulk
TLE2024AQDWREP 功能描述:运算放大器 - 运放 Mil Enhance Excal Hi Spd Lo-pwr Prec RoHS:否 制造商:STMicroelectronics 通道数量:4 共模抑制比（最小值）:63 dB 输入补偿电压:1 mV 输入偏流（最大值）:10 pA 工作电源电压:2.7 V to 5.5 V 安装风格:SMD/SMT 封装 / 箱体:QFN-16 转换速度:0.89 V/us 关闭:No 输出电流:55 mA 最大工作温度:+ 125 C 封装:Reel
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