参数资料
型号: TLE2037MDR
厂商: TEXAS INSTRUMENTS INC
元件分类: 运算放大器
英文描述: OP-AMP, 200 uV OFFSET-MAX, 50 MHz BAND WIDTH, PDSO8
封装: PLASTIC, SOIC-8
文件页数: 23/45页
文件大小: 1027K
代理商: TLE2037MDR
TLE2027, TLE2037, TLE2027A, TLE2037A, TLE2027Y, TLE2037Y
EXCALIBUR LOW-NOISE HIGH-SPEED
PRECISION OPERATIONAL AMPLIFIERS
SLOS192C FEBRUARY 1997 REVISED APRIL 2010
3
TLE202xY chip information
This chip, when properly assembled, displays characteristics similar to the TLE202xC. Thermal compression
or ultrasonic bonding may be used on the doped-aluminum bonding pads. The chip may be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 MILS TYPICAL
BONDING PADS: 4 × 4 MILS MINIMUM
TJmax = 150°C
TOLERANCES ARE ±10%.
ALL DIMENSIONS ARE IN MILS.
PIN (4) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
90
73
(1)
(2)
(3)
(4)
(6)
(7)
(8)
+
OUT
IN +
IN
VCC+
VCC
OFFSET N1
OFFSET N2
(1)
(3)
(2)
(8)
(7)
(4)
(6)
相关PDF资料
PDF描述
TLE2061BID OP-AMP, 1300 uV OFFSET-MAX, 1.8 MHz BAND WIDTH, PDSO8
TLE2061BMFK OP-AMP, 1700 uV OFFSET-MAX, 1.8 MHz BAND WIDTH, CQCC20
TLE2081Y OP-AMP, 6000 uV OFFSET-MAX, 10 MHz BAND WIDTH, UUC8
TLE2081AMFK OP-AMP, 8200 uV OFFSET-MAX, 9.4 MHz BAND WIDTH, CQCC20
TLE2081AMJG OP-AMP, 8200 uV OFFSET-MAX, 9.4 MHz BAND WIDTH, CDIP8
相关代理商/技术参数
参数描述
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TLE2037MJG 制造商:TI 制造商全称:Texas Instruments 功能描述:EXCALIBUR LOW-NOISE HIGH-SPEED PRECISION OPERATIONAL AMPLIFIERS
TLE2037MJGB 制造商:TI 制造商全称:Texas Instruments 功能描述:EXCALIBUR LOW-NOISE HIGH-SPEED PRECISION OPERATIONAL AMPLIFIERS
TLE2037MP 制造商:TI 制造商全称:Texas Instruments 功能描述:EXCALIBUR LOW-NOISE HIGH-SPEED PRECISION OPERATIONAL AMPLIFIERS