参数资料
型号: TLV2461MU
厂商: Texas Instruments, Inc.
英文描述: FAMILY OF LOW POWER RAIL TO RAIL INPUT/OUTPUT OPERATIOANAL AMPLIFIERS WITH SHUTDOWN
中文描述: 家庭的低功耗轨到轨输入/输出OPERATIOANAL放大器,带关断
文件页数: 3/56页
文件大小: 1027K
代理商: TLV2461MU
TLV2460, TLV2461, TLV2462, TLV2463, TLV2464, TLV2465, TLV246xA
FAMILY OF LOW-POWER RAIL-TO-RAIL INPUT/OUTPUT
OPERATIONAL AMPLIFIERS WITH SHUTDOWN
SLOS220I
JULY 1998
REVISED MARCH 2001
3
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
TLV2462M/AM/Q/AQ and TLV2463M/AM/Q/AQ AVAILABLE OPTIONS
PACKAGED DEVICES
TA
VIOmax
AT 25
°
C
SMALL
OUTLINE
(D)
SMALL
OUTLINE
(PW)
CERAMIC DIP
(JG)
CERAMIC
DIP
(J)
CERAMIC
FLATPACK
(U)
CHIP CAR-
RIER
(FK)
40
°
C to 125
°
C
2000
μ
V
TLV2462QD
TLV2463QD
TLV2462QPW
TLV2463QPW
1500
μ
V
TLV2462AQD
TLV2463AQD
TLV2462AQPW
TLV2463AQPW
55
°
C to 125
°
C
2000
μ
V
TLV2462MJG
TLV2463MJ
TLV2462MU
TLV2462MFK
TLV2463MFK
1500
μ
V
TLV2462AMJG
TLV2463AMJ
TLV2462AMU
TLV2462AMFK
TLV2463AMFK
This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLV2462QDR).
TLV2464C/I/AI and TLV2465C/I/AI AVAILABLE OPTIONS
VIOmax
AT 25
°
C
PACKAGED DEVICES
PLASTIC DIP
TA
SMALL OUTLINE
(D)
(N)
TSSOP
(PW)
0
°
C to 70
°
C
2000
μ
V
TLV2464CD
TLV2465CD
TLV2464CN
TLV2465CN
TLV2464CPW
TLV2465CPW
40
°
C to 125
°
C
2000
μ
V
TLV2464ID
TLV2465ID
TLV2464IN
TLV2465IN
TLV2464IPW
TLV2465IPW
1500
μ
V
TLV2464AID
TLV2465AID
TLV2464AIN
TLV2465AIN
TLV2464AIPW
TLV2465AIPW
This package is available taped and reeled. To order this packaging option, add an R suffix to the part
number(e.g., TLV2464CDR).
Chip forms are tested at TA = 25
°
C only.
TLV2464M/AM/Q/AQ and TLV2465M/AM/Q/AQ AVAILABLE OPTIONS
PACKAGED DEVICES
SMALL
OUTLINE
(PW)
TA
VIOmax
AT 25
°
C
SMALL
OUTLINE
(D)
CERAMIC DIP
(J)
CHIP CARRIER
(FK)
-40
°
C to 125
°
C
2000
μ
V
TLV2464QD
TLV2465QD
TLV2464QPW
TLV2465QPW
1500
μ
V
TLV2464AQD
TLV2465AQD
TLV2464AQPW
TLV2465AQPW
55
C to 125
C
°
°
2000
μ
V
TLV2464MJ
TLV2465MJ
TLV2464MFK
TLV2465MFK
1500
μ
V
TLV2464AMJ
TLV2465AMJ
TLV2464AMFK
TLV2465AMFK
This package is available taped and reeled. To order this packaging option, add an R suffix to the part number
(e.g., TLV2464QDR).
相关PDF资料
PDF描述
TLV2460AMFK FAMILY OF LOW POWER RAIL TO RAIL INPUT/OUTPUT OPERATIOANAL AMPLIFIERS WITH SHUTDOWN
TLV2460AMJG FAMILY OF LOW POWER RAIL TO RAIL INPUT/OUTPUT OPERATIOANAL AMPLIFIERS WITH SHUTDOWN
TLV2460AMU FAMILY OF LOW POWER RAIL TO RAIL INPUT/OUTPUT OPERATIOANAL AMPLIFIERS WITH SHUTDOWN
TLV2462AMU FAMILY OF LOW POWER RAIL TO RAIL INPUT/OUTPUT OPERATIOANAL AMPLIFIERS WITH SHUTDOWN
TLV2462Y FAMILY OF LOW-POWER RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS WITH SHUTDOWN
相关代理商/技术参数
参数描述
TLV2461QD 功能描述:运算放大器 - 运放 Single Low Power Rail-to-Rail I/O RoHS:否 制造商:STMicroelectronics 通道数量:4 共模抑制比(最小值):63 dB 输入补偿电压:1 mV 输入偏流(最大值):10 pA 工作电源电压:2.7 V to 5.5 V 安装风格:SMD/SMT 封装 / 箱体:QFN-16 转换速度:0.89 V/us 关闭:No 输出电流:55 mA 最大工作温度:+ 125 C 封装:Reel
TLV2461QDG4 功能描述:运算放大器 - 运放 Sgl Lo Pwr Rail to Rail Input/Output RoHS:否 制造商:STMicroelectronics 通道数量:4 共模抑制比(最小值):63 dB 输入补偿电压:1 mV 输入偏流(最大值):10 pA 工作电源电压:2.7 V to 5.5 V 安装风格:SMD/SMT 封装 / 箱体:QFN-16 转换速度:0.89 V/us 关闭:No 输出电流:55 mA 最大工作温度:+ 125 C 封装:Reel
TLV2461QDR 功能描述:运算放大器 - 运放 Single Low Power Rail-to-Rail I/O RoHS:否 制造商:STMicroelectronics 通道数量:4 共模抑制比(最小值):63 dB 输入补偿电压:1 mV 输入偏流(最大值):10 pA 工作电源电压:2.7 V to 5.5 V 安装风格:SMD/SMT 封装 / 箱体:QFN-16 转换速度:0.89 V/us 关闭:No 输出电流:55 mA 最大工作温度:+ 125 C 封装:Reel
TLV2461QDRG4 功能描述:运算放大器 - 运放 Sgl Lo Pwr Rail to Rail Input/Output RoHS:否 制造商:STMicroelectronics 通道数量:4 共模抑制比(最小值):63 dB 输入补偿电压:1 mV 输入偏流(最大值):10 pA 工作电源电压:2.7 V to 5.5 V 安装风格:SMD/SMT 封装 / 箱体:QFN-16 转换速度:0.89 V/us 关闭:No 输出电流:55 mA 最大工作温度:+ 125 C 封装:Reel
TLV2461QDRG4Q1 功能描述:运算放大器 - 运放 Auto Cat Lo-Pwr Rail to Rail Input/Output RoHS:否 制造商:STMicroelectronics 通道数量:4 共模抑制比(最小值):63 dB 输入补偿电压:1 mV 输入偏流(最大值):10 pA 工作电源电压:2.7 V to 5.5 V 安装风格:SMD/SMT 封装 / 箱体:QFN-16 转换速度:0.89 V/us 关闭:No 输出电流:55 mA 最大工作温度:+ 125 C 封装:Reel