参数资料
型号: TLV2622IPE4
厂商: TEXAS INSTRUMENTS INC
元件分类: 运算放大器
英文描述: DUAL OP-AMP, 4500 uV OFFSET-MAX, 11 MHz BAND WIDTH, PDIP8
封装: PLASTIC, DIP-8
文件页数: 12/24页
文件大小: 965K
代理商: TLV2622IPE4
www.ti.com
TLV2620, TLV2621
TLV2622, TLV2623
TLV2624, TLV2625
SLOS251D – DECEMBER 2000 – REVISED JANUARY 2005
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated
circuits be handled with appropriate precautions. Failure to observe proper handling and installation
procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision
integrated circuits may be more susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
TLV2620 AND TLV2621 AVAILABLE OPTIONS(1)
PACKAGED DEVICES
VIOmax AT
TA
SOT-23
SMALL OUTLINE
25
°C
PLASTIC DIP (P)
(D)(2)
(DBV)(3)
SYMBOL
TLV2620ID
TLV2620IDBV
VBAI
TLV2620IP
-40
°C to 125°C
3500 V
TLV2621ID
TLV2621IDBV
VBBI
TLV2621IP
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(2)
This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLV2620IDR).
(3)
The SOT23 package devices are only available taped and reeled. The R Suffix denotes quantities (3,000 pieces per reel). For smaller
quantities (250 pieces per mini-reel), add a T suffix to the part number (e.g. TLV2620IDBVT).
TLV2622 AND TLV2623 AVAILABLE OPTIONS(1)
PACKAGED DEVICES
VIOmax AT
SMALL
MSOP
PLASTIC
TA
PLASTIC
25
°C
OUTLINE(2)
DIP
DIP (N)
(DGK)(2)
SYMBOL
(DGS)(2)
SYMBOL
(D)
(P)
TLV2622ID
TLV2622IDGK
xxTIAKM
TLV2622IP
-40
°C to 125°C
3500 V
TLV2623ID
TLV2623IDGS
xxTIALC
TLV2623IN
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(2)
This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLV2622IDR).
TLV2624 AND TLV2625 AVAILABLE OPTIONS(1)
PACKAGED DEVICES
VIOmax
TA
SMALL OUTLINE
PLASTIC DIP
TSSOP
AT 25
°C
(D)(2)
(N)
(PW)
TLV2624ID
TLV2624IN
TLV2624IPW
-40
°C to 125°C
3500 V
TLV2625ID
TLV2625IN
TLV2625IPW
(1)
For the most current package and ordering information, see the Package Option Addendum at the
end of this document, or see the TI website at www.ti.com.
(2)
This package is available taped and reeled. To order this packaging option, add an R suffix to the
part number (e.g., TLV2624IDR).
2
相关PDF资料
PDF描述
TLV2625INE4 QUAD OP-AMP, 4500 uV OFFSET-MAX, 11 MHz BAND WIDTH, PDIP16
TLV2632IPE4 DUAL OP-AMP, 4500 uV OFFSET-MAX, 9 MHz BAND WIDTH, PDIP8
TLV2765INE4 QUAD OP-AMP, 6800 uV OFFSET-MAX, 0.5 MHz BAND WIDTH, PDIP16
TLV2765IPWRG4 QUAD OP-AMP, 6800 uV OFFSET-MAX, 0.5 MHz BAND WIDTH, PDSO16
TLV2771QDBVRQ1 OP-AMP, 2700 uV OFFSET-MAX, 4.8 MHz BAND WIDTH, PDSO5
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TLV2623IDGSG4 功能描述:运算放大器 - 运放 800 uA/ch 11MHz RRO Lo-Vltg Dual Ch RoHS:否 制造商:STMicroelectronics 通道数量:4 共模抑制比(最小值):63 dB 输入补偿电压:1 mV 输入偏流(最大值):10 pA 工作电源电压:2.7 V to 5.5 V 安装风格:SMD/SMT 封装 / 箱体:QFN-16 转换速度:0.89 V/us 关闭:No 输出电流:55 mA 最大工作温度:+ 125 C 封装:Reel
TLV2623IDGSR 功能描述:运算放大器 - 运放 800 uA/ch 11MHz RRO Lo-Vltg Dual Ch RoHS:否 制造商:STMicroelectronics 通道数量:4 共模抑制比(最小值):63 dB 输入补偿电压:1 mV 输入偏流(最大值):10 pA 工作电源电压:2.7 V to 5.5 V 安装风格:SMD/SMT 封装 / 箱体:QFN-16 转换速度:0.89 V/us 关闭:No 输出电流:55 mA 最大工作温度:+ 125 C 封装:Reel
TLV2623IDGSRG4 功能描述:运算放大器 - 运放 800 uA/ch 11MHz RRO Lo-Vltg Dual Ch RoHS:否 制造商:STMicroelectronics 通道数量:4 共模抑制比(最小值):63 dB 输入补偿电压:1 mV 输入偏流(最大值):10 pA 工作电源电压:2.7 V to 5.5 V 安装风格:SMD/SMT 封装 / 箱体:QFN-16 转换速度:0.89 V/us 关闭:No 输出电流:55 mA 最大工作温度:+ 125 C 封装:Reel
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