参数资料
型号: TLV803ZDBZT
厂商: Texas Instruments
文件页数: 10/16页
文件大小: 0K
描述: IC VOLT SUPERVISR 2.25V SOT23-3
标准包装: 250
类型: 简单复位/加电复位
监视电压数目: 1
输出: 开路漏极或开路集电极
复位: 低有效
复位超时: 最小为 120 ms
电压 - 阀值: 2.25V
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: TO-236-3,SC-59,SOT-23-3
供应商设备封装: SOT-23-3
包装: 带卷 (TR)
PACKAGE OPTION ADDENDUM
www.ti.com
PACKAGING INFORMATION
11-Apr-2013
Orderable Device
Status
Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
Samples
(1)
Drawing
Qty
(2)
(3)
(4)
TLV803MDBZR
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
VOUQ
& no Sb/Br)
TLV803MDBZT
ACTIVE
SOT-23
DBZ
3
250
Green (RoHS
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
VOUQ
& no Sb/Br)
TLV803RDBZR
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
VOSQ
& no Sb/Br)
TLV803RDBZT
ACTIVE
SOT-23
DBZ
3
250
Green (RoHS
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
VOSQ
& no Sb/Br)
TLV803SDBZR
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
VOTQ
& no Sb/Br)
TLV803SDBZT
ACTIVE
SOT-23
DBZ
3
250
Green (RoHS
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
VOTQ
& no Sb/Br)
TLV803ZDBZR
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
VORQ
& no Sb/Br)
TLV803ZDBZT
ACTIVE
SOT-23
DBZ
3
250
Green (RoHS
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
VORQ
& no Sb/Br)
TLV863MDBZR
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
VTWM
& no Sb/Br)
TLV863MDBZT
ACTIVE
SOT-23
DBZ
3
250
Green (RoHS
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
VTWM
& no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
Addendum-Page 1
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