参数资料
型号: TLV810SDBZR
厂商: TEXAS INSTRUMENTS INC
元件分类: 电源管理
英文描述: POWER SUPPLY SUPPORT CKT, PDSO3
封装: GREEN, PLASTIC, SOT-23, 3 PIN
文件页数: 2/8页
文件大小: 111K
代理商: TLV810SDBZR
SBVS158A
– APRIL 2011 – REVISED JUNE 2011
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION(1)
SPECIFIED
THRESHOLD
PACKAGE-
PACKAGE
OPERATING
PACKAGE
ORDERING
TRANSPORT MEDIA,
PRODUCT
VOLTAGE
LEAD
DESIGNATOR
TEMPERATURE
MARKING
INFORMATION
QUANTITY
TLV810ZDBZR
Tape and Reel, 3000
TLV810Z
2.25 V
SOT23-3
DBZ
–40°C to +125°C
VOVQ
TLV810ZDBZT
Tape and Reel, 250
TLV810RDBZR
Tape and Reel, 3000
TLV810R
2.64 V
SOT23-3
DBZ
–40°C to +125°C
VOWQ
TLV810RDBZT
Tape and Reel, 250
TLV810SDBZR
Tape and Reel, 3000
TLV810S
2.93 V
SOT23-3
DBZ
–40°C to +125°C
VOXQ
TLV810SDBZT
Tape and Reel, 250
TLV810MDBZR
Tape and Reel, 3000
TLV810M
4.38 V
SOT23-3
DBZ
–40°C to +125°C
VOYQ
TLV810MDBZT
Tape and Reel, 250
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this data sheet, or visit the
ABSOLUTE MAXIMUM RATINGS
(1)
Over operating free-air temperature range (unless otherwise noted).
VALUE
MIN
MAX
UNIT
VDD
(2)
0
7
V
Voltage
All other pins(2)
–0.3
7
V
Maximum low output current, IOL
5
mA
Maximum high output current, IOH
–5
mA
Current
Input clamp current, IIK (VI < 0 or VI > VDD)
±20
mA
Output clamp current, IOK (VO < 0 or VO > VDD)
±20
mA
Operating free-air temperature range, TA
–40
+125
°C
Temperature
Storage temperature range, Tstg
–65
+150
°C
Soldering temperature
+260
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltage values are with respect to GND. For reliable operation the device should not be operated at 7 V for more than t = 1000h
continuously.
THERMAL INFORMATION
TLV810
THERMAL METRIC(1)
DBZ
UNITS
3 PINS
θJA
Junction-to-ambient thermal resistance
286.9
θJCtop
Junction-to-case (top) thermal resistance
105.6
θJB
Junction-to-board thermal resistance
124.4
°C/W
ψJT
Junction-to-top characterization parameter
25.8
ψJB
Junction-to-board characterization parameter
107.9
θJCbot
Junction-to-case (bottom) thermal resistance
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
2
Copyright
2011, Texas Instruments Incorporated
相关PDF资料
PDF描述
TLW-122-01-G-D 44 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
TLW-125-01-G-D-RA 50 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SOLDER
TLW-122-01-G-S 22 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
TLW-122-01-T-D 44 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
TLW-122-01-T-S 22 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
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