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参数资料
| 型号： | TMC1175AB2F20 |
| 厂商： | FAIRCHILD SEMICONDUCTOR CORP |
| 元件分类： | ADC |
| 英文描述： | 1-CH 8-BIT FLASH METHOD ADC, PARALLEL ACCESS, CDIP24 |
| 封装： | CERAMIC, DIP-24 |
| 文件页数： | 5/20页 |
| 文件大小： | 427K |
| 代理商： | TMC1175AB2F20 |
PRODUCT SPECIFICATION
TMC1175A
REV. 1.3.3 2/28/02
13
Figure 12. Typical Interface Circuit-High Performance
+5V
+
-
+
-
0.1
F
2V
0.1mF
0.1
F
VDDA
VDDD
VR+
RT
RB
VR-
VIN
AGND
DGND
OE
CONV
D7-0
TMC1175A
0.1
F
0.1
F
2k
1k
LM385
1k
1k
75
455
455
20
Video
Input
+5V
Regulated +5V
Gain Adjust
+5V
27056A
Wideband
Op-amp
Figure 13. Typical Interface Circuit – Low Cost
Figure 14. Typical Interface Circuit – Stabilized Reference
0.1
F
0.1
F
0.1
F
10
F
+5V
2.2k
2k
560
75
Video
Input
24458A
Offset
Adjust
+5V
0.1
F
0.1
F
VDDA
VDDD
VR+
RT
RB
VR-
VIN
AGND
DGND
OE
CONV
D7-0
TMC1175A
0.1
F
10
F
1k
1k
56
RF
Input
24457A
+5V
0.1
F
0.1
F
VDDA
VDDD
VR+
RT
RB
VR-
VIN
AGND
DGND
OE
CONV
D7-0
TMC1175A
LM385
Grounding
The TMC1175A has separate analog and digital
circuits. To keep digital system noise from the A/D
converter, it is recommended that power supply voltages
(VDDD and VDDA) originate from separate sources with
VDDA regulated, and that ground connections (DGND and
AGND) be made to the analog ground plane. Power supply
pins should be individually decoupled at the pin. The digital
circuitry that gets its input from the TMC1175A should be
referred to the system digital ground plane.
Printed Circuit Board Layout
Designing with high performance mixed-signal circuits
demands printed circuits with ground planes. Wire-wrap is
not an option, even for breadboarding. Overall system per-
formance is strongly inuenced by the board layout. Capac-
itive coupling from digital to analog circuits may result in
poor A/D conversion. Consider the following suggestions
when doing the layout:
1.
Keep the critical analog traces (VIN, RT, RB, VR+,
VR-) as short as possible and as far as possible from all
digital signals. The TMC1175A should be located near
the board edge, close to the analog input connectors.
2.
The power plane for the TMC1175A should be sepa-
rate from that which supplies the rest of the digital cir-
cuitry. A single power plane should be used for all of
the VDD pins. If the power supply for the TMC1175A
is the same as that of the system's digital circuitry,
power to the TMC1175A should be decoupled with
ferrite beads and 0.1F capacitors to reduce noise.
3.
The ground plane should be solid, not cross-hatched.
Connections to the ground plane should have very
short leads.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| TMC1175AC3F20 | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| TMC1175AM7C20 | 功能描述:视频模拟/数字化转换器集成电路 Mixed Signal FG RoHS:否 制造商:Texas Instruments 输入信号类型:Differential 转换器数量:1 ADC 输入端数量:4 转换速率:3 Gbps 分辨率:8 bit 结构: 输入电压:3.3 V 接口类型:SPI 信噪比: 电压参考: 电源电压-最大:3.45 V 电源电压-最小:3.15 V 最大功率耗散: 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:TCSP-48 封装:Reel |
| TMC1175AM7C20_Q | 功能描述:视频模拟/数字化转换器集成电路 Mixed Signal FG RoHS:否 制造商:Texas Instruments 输入信号类型:Differential 转换器数量:1 ADC 输入端数量:4 转换速率:3 Gbps 分辨率:8 bit 结构: 输入电压:3.3 V 接口类型:SPI 信噪比: 电压参考: 电源电压-最大:3.45 V 电源电压-最小:3.15 V 最大功率耗散: 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:TCSP-48 封装:Reel |
| TMC1175AM7C20T | 功能描述:视频模拟/数字化转换器集成电路 8Bit Video Converter 20MSPS a/D RoHS:否 制造商:Texas Instruments 输入信号类型:Differential 转换器数量:1 ADC 输入端数量:4 转换速率:3 Gbps 分辨率:8 bit 结构: 输入电压:3.3 V 接口类型:SPI 信噪比: 电压参考: 电源电压-最大:3.45 V 电源电压-最小:3.15 V 最大功率耗散: 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:TCSP-48 封装:Reel |
| TMC1175AM7C30 | 功能描述:视频模拟/数字化转换器集成电路 8Bit Video Converter 3MSPS a/D RoHS:否 制造商:Texas Instruments 输入信号类型:Differential 转换器数量:1 ADC 输入端数量:4 转换速率:3 Gbps 分辨率:8 bit 结构: 输入电压:3.3 V 接口类型:SPI 信噪比: 电压参考: 电源电压-最大:3.45 V 电源电压-最小:3.15 V 最大功率耗散: 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:TCSP-48 封装:Reel |
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