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参数资料
| 型号： | TMK107SD332KA-T |
| 厂商： | Taiyo Yuden |
| 文件页数： | 15/18页 |
| 文件大小： | 0K |
| 描述： | CAP CER 3300PF 25V 10% 0603 |
| 标准包装： | 4,000 |
| 系列： | CFCAP™ |
| 电容： | 3300pF |
| 电压 - 额定： | 25V |
| 容差： | ±10% |
| 安装类型： | 表面贴装，MLCC |
| 工作温度： | -55°C ~ 125°C |
| 应用： | RF，微波，高频 |
| 封装/外壳： | 0603（1608 公制） |
| 尺寸/尺寸： | 0.063" L x 0.031" W（1.60mm x 0.80mm） |
| 厚度（最大）： | 0.035"（0.90mm） |
| 特点： | 低失真 |
| 包装： | 带卷 (TR) |
（2）Examples of good and bad solder application
Item
Not recommended
Lead wire of component
Recommended
Solder-resist
Mixed mounting of SMD and
leaded components
Chassis
Component placement close to
the chassis
Solder (for grounding)
Electrode pattern
Lead wire of component
Solder-resist
Hand-soldering of leaded
Soldering iron
Solder-resist
components near mounted
components
Solder-resist
Horizontal component
placement
◆Pattern configurations （Capacitor layout on PCBs）
1-1. The following is examples of good and bad capacitor layouts ; capacitors shall be located to minimize any
stresses from board warp or deflection.
possible mechanical
Items
Deflection of board
Not recommended
Recommended
Place the product at a right
angle to the direction of the
anticipated mechanical
stress.
1-2. The amount of mechanical stresses given will vary depending on capacitor layout. Please refer to diagram below.
E
D
Perforation
C
A
Slit
B
Magnitude of stress
A＞B＝C＞D＞E
1-3. When PCB is split, the amount of mechanical stress on the capacitors can vary according to the method used. The following methods
are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, please consider the PCB,
split methods as well as chip location.
3. Mounting
◆Adjustment of mounting machine
1. When capacitors are mounted on PCB, excessive impact load shall not be imposed on them.
2. Maintenance and inspection of mounting machines shall be conducted periodically.
Precautions
◆Selection of Adhesives
1. When chips are attached on PCBs with adhesives prior to soldering, it may cause capacitor characteristics degradation unless the
following factors are appropriately checked : size of land patterns, type of adhesive, amount applied, hardening temperature and
hardening period. Therefore, please contact us for further information.
? This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_prec_e-E02R01
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相关代理商/技术参数 |
参数描述 |
|---|---|
| TMK107SD392JA-T | 功能描述:多层陶瓷电容器MLCC - SMD/SMT CAP LW DISTORT 0603 25V 3.9nF 5% RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| TMK107SD392KA-T | 功能描述:多层陶瓷电容器MLCC - SMD/SMT CAP LW DISTORT 0603 25V 3.9nF 10% RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| TMK107SD472JA-T | 功能描述:多层陶瓷电容器MLCC - SMD/SMT CAP LW DISTORT 0603 25V 4.7nF 5% RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| TMK107SD472KA-T | 功能描述:多层陶瓷电容器MLCC - SMD/SMT CAP LW DISTORT 0603 25V 4.7nF 10% RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| TMK12024 | 制造商:TE Connectivity 功能描述: 制造商:TE Connectivity / Schrack Brand 功能描述: |
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