参数资料
型号: TMK316BJ335KL-T
厂商: Taiyo Yuden
文件页数: 14/28页
文件大小: 0K
描述: CAP CER 3.3UF 25V 10% X5R 1206
产品变化通告: X5R, X7R Part Number Change
标准包装: 2,000
系列: M
电容: 3.3µF
电压 - 额定: 25V
容差: ±10%
温度系数: X5R
安装类型: 表面贴装,MLCC
工作温度: -55°C ~ 85°C
应用: 通用
封装/外壳: 1206(3216 公制)
尺寸/尺寸: 0.126" L x 0.063" W(3.20mm x 1.60mm)
厚度(最大): 0.071"(1.80mm)
包装: 带卷 (TR)
Multilayer Ceramic Capacitors
■ PACKAGING
①Minimum Quantity
● Taped package
Type(EIA)
mm
Thickness
code
Standard quantity [pcs]
Paper tape Embossed tape
□MK042(01005)
□VS042(01005)
□MK063(0201)
□WK105(0204) ※
□MK105(0402)
□VK105(0402) ※
□MK107(0603)
□WK107(0306) ※
□MR107(0603)
□MK212(0805)
□WK212(0508) ※
□MR212(0805)
□MK316(1206)
□MR316(1206)
0.2
0.2
0.3
0.3
0.2
0.3
0.5
0.5
0.45
0.5
0.8
0.45
0.85
125
0.85
1.15
125
1.6
C, D
C
P, T
P
C
P
V
W
K
V
A
K
D
G
D
F
G
L
15000
10000
20000
15000
10000
4000
4000
4000
40000
4000
3000
3000
2000
0.85
D
□MK325(1210)
□MR325(1210)
□MK432(1812)
1.15
1.9
2.0max.
2.5
2.5
F
N
Y
M
M
2000
500(T), 1000(P)
500
Note : ※ LW Reverse type.
②Taping material
※No bottom tape for pressed carrier tape
● Card board carrier tape
Top tape
Base tape
Sprocket hole
● Embossed tape
Top tape
Sprocket hole
Bottom tape
Chip cavity
Base tape
Chip cavity
Chip filled
Chip
? This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_pack_e-E02R01
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