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| 型号： | TMP03FT9Z |
| 厂商： | Analog Devices Inc |
| 文件页数： | 16/16页 |
| 文件大小： | 214K |
| 描述： | IC SENSOR TEMP/SERIAL OC TO-92-3 |
| 标准包装： | 100 |
| 功能： | 温度监控系统（传感器） |
| 传感器类型： | 内部 |
| 感应温度： | -40°C ~ 100°C |
| 精确度： | ±4°C（最小值） |
| 拓扑： | ADC（三角积分型），数字调制器 |
| 输出类型： | 开路集电极 |
| 输出警报： | 无 |
| 输出风扇： | 无 |
| 电源电压： | 4.5 V ~ 7 V |
| 工作温度： | -55°C ~ 150°C |
| 安装类型： | 通孔 |
| 封装/外壳： | TO-226-3、TO-92-3 标准主体 |
| 供应商设备封装： | TO-92-3 |
| 包装： | 散装 |
| 产品目录页面： | 798 (CN2011-ZH PDF) |
TMP03/TMP04
REV. A
16
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
3-Pin TO-92
0.105 (2.66)
0.080 (2.42)
0.105 (2.66)
0.080 (2.42)
0.165 (4.19)
0.125 (3.94)
SQUARE
0.019 (0.482)
0.016 (0.407)
0.105 (2.66)
0.095 (2.42)
0.055 (1.39)
0.045 (1.15)
SEATING
PLANE
0.500
(12.70)
MIN
0.205 (5.20)
0.175 (4.96)
0.210 (5.33)
0.170 (4.38)
1
2
3
BOTTOM
VIEW
0.135
(3.43)
MIN
0.050
(1.27)
MAX
8-Pin SOIC (SO-8)
8 5
4
1
0.1968 (5.00)
0.1890 (4.80)
0.2440 (6.20)
0.2284 (5.80)
PIN 1
0.1574 (4.00)
0.1497 (3.80)
0.0500 (1.27)
BSC
0.0688 (1.75)
0.0532 (1.35)
SEATING
PLANE
0.0098 (0.25)
0.0040 (0.10)
0.0192 (0.49)
0.0138 (0.35)
0.0098 (0.25)
0.0075 (0.19)
0.0500 (1.27)
0.0160 (0.41)
8
0
0.0196 (0.50)
0.0099 (0.25)
45
8-Pin TSSOP (RU-8)
8
5
4
1
0.256 (6.50)
0.246 (6.25)
0.177 (4.50)
0.169 (4.30)
PIN 1
0.0256 (0.65)
BSC
0.122 (3.10)
0.114 (2.90)
SEATING
PLANE
0.006 (0.15)
0.002 (0.05)
0.0118 (0.30)
0.0075 (0.19)
0.0433
(1.10)
MAX
0.0079 (0.20)
0.0035 (0.090)
0.028 (0.70)
0.020 (0.50)
8
0
advantage in this application because it produces a linear tem-
perature output while needing only one I/O pin and without
requiring an A/D converter.
PC BOARD
TMP04 IN SURFACE MOUNT PACKAGE
FAST MICROPROCESSOR, DSP , ETC., IN PGA PACKAGE
PGA SOCKET
Figure 13. Monitoring the Temperature of a High Power
Microprocessor Improves System Reliability
Thermal Response Time
The time required for a temperature sensor to settle to a speci-
fied accuracy is a function of the thermal mass of, and the
thermal conductivity between, the sensor and the object being
sensed. Thermal mass is often considered equivalent to capaci-
tance. Thermal conductivity is commonly specified using the
symbol ? and can be thought of as thermal resistance. It is
commonly specified in units of degrees per watt of power trans-
ferred across the thermal joint. Thus, the time required for the
TMP03 to settle to the desired accuracy is dependent on the
package selected, the thermal contact established in that par-
ticular application, and the equivalent power of the heat source.
In most applications, the settling time is probably best deter-
mined empirically. The TMP03 output operates at a nominal
frequency of 35 Hz at 25癈, so the minimum settling time reso-
lution is 27 ms.
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