参数资料
型号: TNY263GN-TL
厂商: Power Integrations
文件页数: 19/22页
文件大小: 0K
描述: IC OFFLINE SWIT OTP OCP HV 8SMD
标准包装: 1
系列: TinySwitch®-II
输出隔离: 隔离
频率范围: 124kHz ~ 140kHz
输出电压: 700V
功率(瓦特): 7.5W
工作温度: -40°C ~ 150°C
封装/外壳: 8-SMD(7 个接脚),鸥形翼
供应商设备封装: SMD-8B
包装: 剪切带 (CT)
其它名称: 596-1044-1
TNY263-268
DIP- 8 B
-E-
. 240  (6.10)
.260 (6.60)
Pin 1
⊕ D S .004 (.10)
.137 (3.4 8 )
MINIMUM
Notes:
1. Package dimensions conform to JEDEC specification
MS-001-AB (Issue B 7/ 8 5) for standard dual-in-line (DIP)
package with .300 inch row spacing.
2. Controlling dimensions are inches. Millimeter sizes are
shown in parentheses.
3. Dimensions shown do not include mold flash or other
protrusions. Mold flash or protrusions shall not exceed
.006 (.15) on any side.
4. Pin locations start with Pin 1, and continue counter-clock-
wise to Pin 8 when viewed from the top. The notch and/or
dimple are aids in locating Pin 1. Pin 6 is omitted.
5. Minimum metal to metal spacing at the package body for
the omitted lead location is .137 inch (3.4 8 mm).
-D-
.367 (9.32)
.3 8 7 (9. 8 3)
.057 (1.45)
.06 8 (1.73)
6. Lead width measured at package body.
7. Lead spacing measured with the leads constrained to be
perpendicular to plane T.
(NOTE 6)
.125 (3.1 8 )
.145 (3.6 8 )
-T-
.015 (.3 8 )
MINIMUM
SEATING
PLANE
.120 (3.05)
.00 8 (.20)
.015 (.3 8 )
.140 (3.56)
.300 (7.62) BSC
.100 (2.54) BSC
.04 8 (1.22)
(NOTE 7)
.014 (.36)
.022 (.56)
.053 (1.35)
⊕ T E D S .010 (.25) M
.300 (7.62 )
.390 (9.91)
P0 8 B
PI-2551-121504
19
www.powerint.com
Rev. H 02/09
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