参数资料
型号: TNY278GN
厂商: Power Integrations
文件页数: 20/24页
文件大小: 0K
描述: IC OFFLINE SWIT OVP OTP HV 8SMD
标准包装: 50
系列: TinySwitch®-III
输出隔离: 隔离
频率范围: 124kHz ~ 140kHz
输出电压: 700V
功率(瓦特): 28W
工作温度: -40°C ~ 150°C
封装/外壳: 8-SMD(7 个接脚),鸥形翼
供应商设备封装: SMD-8C
包装: 管件
配用: 596-1194-ND - KIT DESIGN REF TINYSWITCH-III
TNY274-280
50
Scaling Factors:
1.2
40
30
TNY274 1.0
TNY275 1.5
TNY276 2.0
TNY277 3.5
TNY278 5.5
1.0
0.8
20
10
TNY279 7.3
TNY280 11
0.6
0.4
0.2
0
0
-50
-25
0
25
50
75
100 125
0
200
400
600
Junction Temperature ( ° C)
DRAIN Voltage (V)
Figure 26. Drain Capacitance Power.
DIP-8C
Figure 27. Undervoltage Threshold vs. Temperature.
-E-
.240 (6.10)
.260 (6.60)
Pin 1
⊕ D S
.004 (.10)
Notes:
1. Package dimensions conform to JEDEC specification
MS-001-AB (Issue B 7/85) for standard dual-in-line (DIP)
package with .300 inch row spacing.
2. Controlling dimensions are inches. Millimeter sizes are
shown in parentheses.
3. Dimensions shown do not include mold flash or other
protrusions. Mold flash or protrusions shall not exceed
.006 (.15) on any side.
4. Pin locations start with Pin 1, and continue counter-clock-
wise to Pin 8 when viewed from the top. The notch and/or
dimple are aids in locating Pin 1. Pin 3 is omitted.
5. Minimum metal to metal spacing at the package body for
-T-
-D-
.125 (3.18)
.145 (3.68)
.367 (9.32)
.387 (9.83)
.057 (1.45)
.068 (1.73)
(NOTE 6)
.015 (.38)
MINIMUM
the omitted lead location is .137 inch (3.48 mm).
6. Lead width measured at package body.
7. Lead spacing measured with the leads constrained to be
perpendicular to plane T.
SEATING
PLANE
.120 (3.05)
.008 (.20)
.015 (.38)
.140 (3.56)
.300 (7.62) BSC
.100 (2.54) BSC
.048 (1.22)
.137 (3.48)
(NOTE 7)
.014 (.36)
.022 (.56)
⊕ T E D S .010 (.25) M
.053 (1.35) MINIMUM
.300 (7.62)
.390 (9.91)
P08C
PI-3933-100504
20
Rev. I 01/09
www.powerint.com
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