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参数资料
| 型号： | TP3067V/NOPB |
| 厂商： | National Semiconductor |
| 文件页数： | 6/20页 |
| 文件大小： | 0K |
| 描述： | IC INTERFACE ENHANCED SER 20PLCC |
| 标准包装： | 40 |
| 类型： | PCM 编解码器/滤波器 |
| 数据接口： | 串行 |
| 分辨率（位）： | 8 b |
| ADC / DAC 数量： | 1 / 1 |
| 三角积分调变： | 无 |
| 电压 - 电源，模拟： | ±5V |
| 电压 - 电源，数字： | ±5V |
| 工作温度： | -25°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 20-LCC（J 形引线） |
| 供应商设备封装： | 20-PLCC |
| 包装： | 管件 |
| 其它名称： | *TP3067V *TP3067V/NOPB TP3067V |
Applications Information
POWER SUPPLIES
While the pins of the TP3060 family are well protected
against electrical misuse it is recommended that the stan-
dard CMOS practice be followed ensuring that ground is
connected to the device before any other connections are
made In applications where the printed circuit board may be
plugged into a ‘‘hot’’ socket with power and clocks already
present an extra long ground pin in the connector should
be used
All ground connections to each device should meet at a
common point as close as possible to the GNDA pin This
minimizes the interaction of ground return currents flowing
through a common bus impedance 01 mF supply decou-
pling capacitors should be connected from this common
ground point to VCC and VBB as close to the device as
possible
For best performance the ground point of each CODEC
FILTER on a card should be connected to a common card
ground in ‘‘STAR’’ formation rather than via a ground bus
This common ground point should be decoupled to VCC and
VBB with 10 mF capacitors
Note
See Application Note 370 for further details
Typical Asynchronous Application
TLH5070 – 5
Note 1
Transmit gain e 20 c log
R1aR2
R2
J (R1 a R2) t 10 kX
Note 2
Receive gain e 20 c log
2cR3
R4
J R4 t 10 kX
FIGURE 4
13
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| TP3064WM-X | IC INTERFACE ENHANCED SER 20SOIC |
| VE-24T-CV-S | CONVERTER MOD DC/DC 6.5V 150W |
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相关代理商/技术参数 |
参数描述 |
|---|---|
| TP3067V-X | 功能描述:IC INTERFACE ENHANCED SER 20PLCC RoHS:否 类别:集成电路 (IC) >> 接口 - 编解码器 系列:- 标准包装:2,500 系列:- 类型:立体声音频 数据接口:串行 分辨率（位）:18 b ADC / DAC 数量:2 / 2 三角积分调变:是 S/N 比，标准 ADC / DAC (db):81.5 / 88 动态范围，标准 ADC / DAC (db):82 / 87.5 电压 - 电源，模拟:2.6 V ~ 3.3 V 电压 - 电源，数字:1.7 V ~ 3.3 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:48-WFQFN 裸露焊盘 供应商设备封装:48-TQFN-EP（7x7） 包装:带卷 (TR) |
| TP3067WM | 功能描述:接口—CODEC RoHS:否 制造商:Texas Instruments 类型: 分辨率: 转换速率:48 kSPs 接口类型:I2C ADC 数量:2 DAC 数量:4 工作电源电压:1.8 V, 2.1 V, 2.3 V to 5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:DSBGA-81 封装:Reel |
| TP3067WM/63 | 制造商:Texas Instruments 功能描述: |
| TP3067WM/63SN | 功能描述:接口—CODEC RoHS:否 制造商:Texas Instruments 类型: 分辨率: 转换速率:48 kSPs 接口类型:I2C ADC 数量:2 DAC 数量:4 工作电源电压:1.8 V, 2.1 V, 2.3 V to 5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:DSBGA-81 封装:Reel |
| TP3067WM/NOPB | 功能描述:接口—CODEC RoHS:否 制造商:Texas Instruments 类型: 分辨率: 转换速率:48 kSPs 接口类型:I2C ADC 数量:2 DAC 数量:4 工作电源电压:1.8 V, 2.1 V, 2.3 V to 5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:DSBGA-81 封装:Reel |
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