参数资料
型号: TPA2008D2EVM
厂商: Texas Instruments
文件页数: 13/26页
文件大小: 0K
描述: EVAL MODULE FOR TPA2008D2
标准包装: 1
放大器类型: D 类
输出类型: 2 通道(立体声)
在某负载时最大输出功率 x 通道数量: 3W x 2 @ 3 欧姆
电源电压: 4.5 V ~ 5.5 V
工作温度: -40°C ~ 85°C
板类型: 完全填充
已用 IC / 零件: TPA2008D2
已供物品:
产品目录页面: 876 (CN2011-ZH PDF)
相关产品: TPA2008D2PWPRG4-ND - IC AMP AUDIO PWR 3W STER 24TSSOP
TPA2008D2PWPG4-ND - IC AMP AUDIO PWR 3W STER 24TSSOP
296-17158-6-ND - IC AMP AUDIO PWR 3W STER 24TSSOP
296-17158-1-ND - IC AMP AUDIO PWR 3W STER 24TSSOP
296-17158-2-ND - IC AMP AUDIO PWR 3W STER 24TSSOP
296-15339-5-ND - IC AMP AUDIO PWR 3W STER 24TSSOP
其它名称: 296-18922
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
TPA2008D2PWP
ACTIVE
HTSSOP
PWP
24
60
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TPA2008D2PWPG4
ACTIVE
HTSSOP
PWP
24
60
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TPA2008D2PWPR
ACTIVE
HTSSOP
PWP
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TPA2008D2PWPRG4
ACTIVE
HTSSOP
PWP
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com
18-Apr-2006
Addendum-Page 1
相关PDF资料
PDF描述
EBM25DTMD CONN EDGECARD 50POS R/A .156 SLD
EBM25DTMH CONN EDGECARD 50POS R/A .156 SLD
Q2-F-5/8-01-QB48IN-5 HEATSHRINK POLY 5/8" BLK 4'
MLF2012A3R9K INDUCTOR MULTILAYER 3.9UH 0805
MAX6165BESA+ IC VREF SERIES PREC 5V 8-SOIC
相关代理商/技术参数
参数描述
TPA2008D2PWP 功能描述:音频放大器 Stereo Hi-Pwr 5-V Filter-Free Class-D RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel
TPA2008D2PWPG4 功能描述:音频放大器 Stereo Hi-Pwr 5-V Filter-Free Class-D RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel
TPA2008D2PWPR 功能描述:音频放大器 Stereo Hi-Pwr 5-V Filter-Free Class-D RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel
TPA2008D2PWPRG4 功能描述:音频放大器 Stereo Hi-Pwr 5-V Filter-Free Class-D RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel
TPA200RL 功能描述:TVS 二极管 - 瞬态电压抑制器 200V 50uA Bidirect RoHS:否 制造商:Vishay Semiconductors 极性:Bidirectional 工作电压: 击穿电压:58.9 V 钳位电压:77.4 V 峰值浪涌电流:38.8 A 系列: 封装 / 箱体:DO-214AB 最小工作温度:- 55 C 最大工作温度:+ 150 C