参数资料
型号: TPA2012D2RTJRG4
厂商: TEXAS INSTRUMENTS INC
元件分类: 音频/视频放大
英文描述: 2.1 W, 2 CHANNEL, AUDIO AMPLIFIER, PQCC20
封装: 4 X 4 MM, GREEN, PLASTIC, QFN-20
文件页数: 5/22页
文件大小: 785K
代理商: TPA2012D2RTJRG4
BOARD LAYOUT
Copper
Trace Width
Solder Mask
Thickness
Solder
Pad Width
Solder Mask
Opening
Copper Trace
Thickness
Component Location
www.ti.com .................................................................................................................................................. SLOS438D – DECEMBER 2004 – REVISED JUNE 2008
In making the pad size for the WCSP balls, it is recommended that the layout use nonsolder mask defined
(NSMD) land. With this method, the solder mask opening is made larger than the desired land area, and the
opening size is defined by the copper pad width. Figure 36 and Table 2 shows the appropriate diameters for a
WCSP layout. The TPA2012D2 evaluation module (EVM) layout is shown in the next section as a layout
example.
Figure 36. Land Pattern Dimensions
Table 2. Land Pattern Dimensions(1)(2)(3)(4)
SOLDER PAD
COPPER
SOLDER MASK (5)
COPPER
STENCIL (6)(7)
STENCIL
DEFINITIONS
PAD
OPENING
THICKNESS
OPENING
THICKNESS
Nonsolder mask
275
m
275
m x 275 m Sq.
375
m (+0.0, -25 m)
1 oz max (32
m)
125
m thick
defined (NSMD)
(+0.0, -25
m)
(rounded corners)
(1)
Circuit traces from NSMD defined PWB lands should be 75
m to 100 m wide in the exposed area inside the solder mask opening.
Wider trace widths reduce device stand off and impact reliability.
(2)
Best reliability results are achieved when the PWB laminate glass transition temperature is above the operating the range of the
intended application.
(3)
Recommend solder paste is Type 3 or Type 4.
(4)
For a PWB using a Ni/Au surface finish, the gold thickness should be less 0.5 mm to avoid a reduction in thermal fatigue performance.
(5)
Solder mask thickness should be less than 20
m on top of the copper circuit pattern
(6)
Best solder stencil performance is achieved using laser cut stencils with electro polishing. Use of chemically etched stencils results in
inferior solder paste volume control.
(7)
Trace routing away from WCSP device should be balanced in X and Y directions to avoid unintentional component movement due to
solder wetting forces.
Place all the external components very close to the TPA2012D2. Placing the decoupling capacitor, CS, close to
the TPA2012D2 is important for the efficiency of the Class-D amplifier. Any resistance or inductance in the trace
between the device and the capacitor can cause a loss in efficiency.
Copyright 2004–2008, Texas Instruments Incorporated
13
Product Folder Link(s): TPA2012D2
相关PDF资料
PDF描述
TPA2012D2RTJR 2.1 W, 2 CHANNEL, AUDIO AMPLIFIER, PQCC20
TPA2012D2RTJTG4 2.1 W, 2 CHANNEL, AUDIO AMPLIFIER, PQCC20
TPA2012D2RTJT 2.1 W, 2 CHANNEL, AUDIO AMPLIFIER, PQCC20
TPA2012D2YZHR 2.1 W, 2 CHANNEL, AUDIO AMPLIFIER, BGA16
TPA2012D2YZHT 2.1 W, 2 CHANNEL, AUDIO AMPLIFIER, BGA16
相关代理商/技术参数
参数描述
TPA2012D2RTJT 功能描述:音频放大器 2.1W Stereo Class-D Aud Power Amplifier RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel
TPA2012D2RTJTG4 功能描述:音频放大器 2.1W Stereo Class-D Aud Power Amplifier RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel
TPA2012D2YZH 制造商:TI 制造商全称:Texas Instruments 功能描述:2.1 W/CH STEREO FILTER-FREE CLASS-D AUDIO POWER AMPLIFIER
TPA2012D2YZHR 功能描述:音频放大器 2.1W Stereo Class-D Aud Power Amplifier RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel
TPA2012D2YZHT 功能描述:音频放大器 2.1W Stereo Class-D Aud Power Amplifier RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel