参数资料
型号: TPA3106D1VFP
厂商: TEXAS INSTRUMENTS INC
元件分类: 音频/视频放大
英文描述: 40 W, 1 CHANNEL, AUDIO AMPLIFIER, PQFP32
封装: 7 X 7 MM, GREEN, PLASTIC, HLQFP-32
文件页数: 32/35页
文件大小: 1250K
代理商: TPA3106D1VFP
www.ti.com
Biases
&
References
TTL InputBuffer
(VCCCompliant)
Startup
Protection
Logic
VREGok
INP
INN
Ramp
Generator
ROSC
VCCok
4VReg
AVCC
VREG
PWM
Logic
Gain
Control
SHUTDOWN
VBYP
MSTR/SLV
SYNC
AVCC
Gain
Control
GAIN0
GAIN1
4
ToGain Adj.
Blocks&
StartupLogic
MUTE
FAULT
VREG
AGND
VBYP
VREG
VBYP
VClamp
Gen
PVCC
Gate
Drive
Gate
Drive
TTL InputBuffer
(VREG
Compliant)
Thermal
SC
Detect
PVCC
BSN
VCLAMP
PVCC
OUTN
BSP
OUTP
PGND
GainControl
SLOS516B – OCTOBER 2007 – REVISED MARCH 2007
TERMINAL FUNCTIONS (continued)
TERMINAL
I/O
DESCRIPTION
NAME
NO.
Master/Slave select for determining direction of SYNC terminal. HIGH=Master mode, SYNC terminal is
MSTR/SLV
7
I
an output; LOW = slave mode, SYNC terminal accepts a clock input. TTL logic levels with compliance to
VREG.
Clock input/output for synchronizing multiple class-D devices. Direction determined by MSTR/SLV
SYNC
8
I/O
terminal. Input signal not to exceed VREG.
Reference for preamplifier. Nominally equal to 1.25 V. Also controls start-up time via external capacitor
VBYP
11
O
sizing.
4-V regulated output for use by internal cells, GAINx, MUTE, and MSTR/SLV pins only. Not specified for
VREG
10
O
driving other external circuitry.
AVCC
32
High-voltage analog power supply. Not internally connected to PVCCL.
Connect to AGND and PGND – should be star point for both grounds. Internal resistive connection to
AGND and PGND. Thermal vias on the PCB should connect this pad to a large copper area on an
Thermal Pad
internal or bottom layer for the best thermal performance. The Thermal Pad must be soldered to the
PCB for mechanical reliability.
FUNCTIONAL BLOCK DIAGRAM
6
Copyright 2007, Texas Instruments Incorporated
Product Folder Link(s): TPA3106D1
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