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| 型号： | TPA3117D2RHBR |
| 厂商： | TEXAS INSTRUMENTS INC |
| 元件分类： | 音频／视频放大 |
| 英文描述： | AUDIO AMPLIFIER, PQCC32 |
| 封装： | 5 X 5 MM, GREEN, PLASTIC, QFN-32 |
| 文件页数： | 16/30页 |
| 文件大小： | 850K |
| 代理商： | TPA3117D2RHBR |
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www.ti.com
SLOS672 – OCTOBER 2010
PRINTED-CIRCUIT BOARD (PCB) LAYOUT
The TPA3117D2 can be used with a small, inexpensive ferrite bead output filter for most applications. However,
since the Class-D switching edges are fast, it is necessary to take care when planning the layout of the printed
circuit board. The following suggestions will help to meet EMC requirements.
Decoupling capacitors—The high-frequency decoupling capacitors should be placed as close to the PVCC
and AVCC terminals as possible. Large (220 F or greater) bulk power supply decoupling capacitors should
be placed near the TPA3117D2 on the PVCCL and PVCCR supplies. Local, high-frequency bypass
capacitors should be placed as close to the PVCC pins as possible. These caps can be connected to the
thermal pad directly for an excellent ground connection. Consider adding a small, good quality low ESR
ceramic capacitor between 220 pF and 1000 pF and a larger mid-frequency cap of value between 0.1mF and
1mF also of good quality to the PVCC connections at each end of the chip.
Keep the current loop from each of the outputs through the ferrite bead and the small filter cap and back to
PGND as small and tight as possible. The size of this current loop determines its effectiveness as an
antenna.
Grounding—The AVCC (pin 4) decoupling capacitor should be grounded to analog ground (AGND). The
PVCC decoupling capacitors should connect to PGND. Analog ground and power ground should be
connected at the thermal pad, which should be used as a central ground connection or star ground for the
TPA3117D2.
Output filter—The ferrite EMI filter (Figure 39) should be placed as close to the output terminals as possible
for the best EMI performance. The LC filter (Figure 37 and Figure 38) should be placed close to the outputs.
The capacitors used in both the ferrite and LC filters should be grounded to power ground.
Thermal Pad—The thermal pad must be soldered to the PCB for proper thermal performance and optimal
reliability. For recommended PCB footprints, see figures at the end of this data sheet.
For an example layout, see the TPA3117D2 Evaluation Module (TPA3117D2EVM) User Manual. Both the EVM
user manual and the thermal pad application report are available on the TI Web site at http://www.ti.com.
Copyright 2010, Texas Instruments Incorporated
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Product Folder Link(s) :TPA3117D2
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相关代理商/技术参数 |
参数描述 |
|---|---|
| TPA3117D2RHBT | 功能描述:音频放大器 10W Filter-Free Stereo Class-D Amp RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| TPA3117D2RHBT | 制造商:Texas Instruments 功能描述:; Amplifier Class:D; No. of Channels:2; 制造商:Texas Instruments 功能描述:IC, AUDIO PWR AMP, CLASS D 15W QFN-32 |
| TPA3118D2 | 制造商:TI 制造商全称:Texas Instruments 功能描述:15W,30W,50W Filter-Free Class-D Stereo Amplifier Family with AM Avoidance |
| TPA3118D2DAP | 功能描述:音频放大器 50W Stereo Class-D Audio Amp RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| TPA3118D2DAPR | 功能描述:音频放大器 50W Stereo Class-D Audio Amp RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
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